Study of demolding in nanoimprint lithography with pseudoplastic metal nanoparticle fluids

Xia, Weiwei; Su, Yufeng; Tianhao, Li; Liu, Chaoran; Li, Dongxue; Duan, Zhiyong

doi:10.1039/c3ra42822b

Cited by 7 publications

(5 citation statements)

References 17 publications

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“…The molding phase included both the mold insertion and lowering system temperature to room temperature. For the nanoimprint lithography process the mold insertion and removal phases impact the accuracy of the final geometry [ 29 , 49 ]. Thus, it is critical to understand the mechanics of these phases which can vary depending on the shape of the nanoimprint stamp.…”

Section: Methodsmentioning

confidence: 99%

Molecular Dynamics Investigation of the Deformation Mechanism of Gold with Variations in Mold Profiles during Nanoimprinting

Gaikwad

Desai

2021

Materials

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Understanding the deformation behavior during nanoimprint lithography is crucial for high resolution patterning. Molecular dynamics modeling was implemented to investigate the effect of different mold profiles (cylindrical, rectangular, and spherical) on the von Mises stress, lattice dislocations, and material deformation. Relatively higher von Mises stress (1.08 × 107 Pa) was observed for the spherical mold profile compared to the rectangular and cylindrical profiles due to the larger surface area of contact during the mold penetration stage of NIL. Substantial increases in the von Mises stress were observed for all the mold geometries during the mold penetration stage. The von Mises stresses had a reduction in the relaxation and mold retrieval stages based on the rearrangement of the gold atoms. The lattice dislocation during the deformation process revealed the formation of the BCC structure which further reverted to the FCC structure after the mold retrieval. The polyhedral template matching (PTM) method was used to explain the retention of the FCC structure and subsequent ductile behavior of the substrate. The cylindrical mold had the lowest percentage spring back in both of the orthogonal directions and thus replicated the mold profile with high-fidelity as compared to the spherical and rectangular molds. The findings of this research can aid the design of molds for several applications.

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Section: Methodsmentioning

confidence: 99%

Molecular Dynamics Investigation of the Deformation Mechanism of Gold with Variations in Mold Profiles during Nanoimprinting

Gaikwad

Desai

2021

Materials

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“…In recent years, nanoimprint lithography has been widely applied in sensors, microfluidic devices, display devices, functional films, solar cells and integrated circuits as a promising next-generation patterning technology [1][2][3][4][5][6][7]. Metal microstructures can be directly obtained through nanoimprint lithography by using pseudoplastic metal nanoparticle fluid as the transfer medium because of its high fidelity, high yield, high resolution and low process costs [8][9][10]. Nevertheless, the metal interconnects are unstable and poorly conductive after demoulding in nanoimprint lithography, due to the existence of numerous micro pores and residual solvent between the metal nanoparticles.…”

Section: Introductionmentioning

confidence: 99%

Study on the shrinkage behavior and conductivity of silver microwires during electrostatic field assisted sintering

Shangguan¹,

Ma²,

Li³

et al. 2018

J. Phys. D: Appl. Phys.

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An electrostatic field was applied to sintering Ag microwires to achieve a more compact structure and better conductivity. The shrinkage behavior of Ag microwires shows anisotropy, since bigger particle sizes, less micropores and smoother surfaces were observed in the direction of the electrostatic field in comparsion with the direction perpendicular to the electrostatic field, and the shrinkage rate of Ag microwires in the direction of electrostatic field improves about 2.4% with the electrostatic field intensity of 800 V cm−1. The electrostatic field assisted sintering model of Ag microwires is proposed according to thermal diffuse dynamics analysis and experimental research. Moreover, the grain size of Ag microwres sintered with electrostatic field increases with the electrostatic field intensity and reaches 113 nm when the electrostatic field intensity is 800 V cm−1, and the resistivity decreases to 2.07 × 10−8 Ω m as well. This method may overcome the restriction of metal wires which fabricated by the pseudoplastic metal nanoparticle fluid and be used as interconnects in nanoimprint lithography.

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“…A previous study has solved the problem by obtaining the effects of the friction coefficient, the Hamaker constant, the aspect ratios of the patterning, and the size of the metal nanoparticles on the bottom fracture. 16 The current study mainly analyzes the second problem, and analysis of the third problem is underway.…”

Section: Introductionmentioning

confidence: 99%

Analysis of slumping on nanoimprint patterning with pseudoplastic metal nanoparticle fluid

Xia

et al. 2014

RSC Adv.

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Study of demolding in nanoimprint lithography with pseudoplastic metal nanoparticle fluids

Cited by 7 publications

References 17 publications

Molecular Dynamics Investigation of the Deformation Mechanism of Gold with Variations in Mold Profiles during Nanoimprinting

Molecular Dynamics Investigation of the Deformation Mechanism of Gold with Variations in Mold Profiles during Nanoimprinting

Study on the shrinkage behavior and conductivity of silver microwires during electrostatic field assisted sintering

Analysis of slumping on nanoimprint patterning with pseudoplastic metal nanoparticle fluid

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