2010
DOI: 10.1109/lpt.2010.2046483
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Study of InGaN–GaN Light-Emitting Diodes With Different Last Barrier Thicknesses

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Cited by 17 publications
(3 citation statements)
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“…In the simulations, the polarization-induced charges at the interfaces for Ga-and N-polarity cases are strictly calculated by using similar methods developed by Wang et al [20] and Liu et al [21] In addition, AM1.5 incident sunlight is set to be from the top of these structures, and the surface reflectivity is set to be 18%. The Shockley-Read-Hall (SRH) recombination for the InGaN IL that is directly governed by the defect-related nonradiative SRH lifetime is set to be 1 ns, [22,23] and the degree of polarization is set to be 0.9 with considering that the actual polarization charge will be partially screened.…”
Section: Sample Structures and Calculation Methodsmentioning
confidence: 99%
“…In the simulations, the polarization-induced charges at the interfaces for Ga-and N-polarity cases are strictly calculated by using similar methods developed by Wang et al [20] and Liu et al [21] In addition, AM1.5 incident sunlight is set to be from the top of these structures, and the surface reflectivity is set to be 18%. The Shockley-Read-Hall (SRH) recombination for the InGaN IL that is directly governed by the defect-related nonradiative SRH lifetime is set to be 1 ns, [22,23] and the degree of polarization is set to be 0.9 with considering that the actual polarization charge will be partially screened.…”
Section: Sample Structures and Calculation Methodsmentioning
confidence: 99%
“…The Original LED was constructed with a 3-lm-thick n-Al 0.55 Ga 0.45 N (electron concentration: 2.0 9 10 18 cm À3 ) and five periods of 2-nm-thick Al 0.38 Ga 0.62 N QWs separated by 10-nm-thick Al 0.50 Ga 0.50 N QBs. To avoid electron leakage from the MQWs, the thickness of the undoped last quantum barrier (LQB), i.e., Al 0.5 Ga 0.5 N, was set to 20 nm, 20,21 and then a 10-nm-thick p-Al 0.60 Ga 0.40 N electron blocking layer (EBL) (hole concentration: 1.5 9 10 17 cm À3 ) was designed on the top of the LQB. The design was capped with a 10nm-thick p-Al 0.55 Ga 0.45 N (hole concentration: 2.5 9 10 17 cm À3 ).…”
Section: Device Structures and Parametersmentioning
confidence: 99%
“…The active region is composed of five 2.3-nm-thick undoped Al 0.38 Ga 0.62 N QWs sandwiched by 10-nm-thick Si doped Al 0.5 Ga 0.5 N QBs (n = 1.0 × 10 18 cm −3 ). To alleviate electron escape from the active region, the thickness of the undoped Al 0.5 Ga 0.5 N LQB is increased to 20 nm, 20,21) and a 10-nm-thick p-typeAl 0.65 Ga 0.35 N EBL (p = 5.0 × 10 16 cm −3 ) is grown on top of the LQB. Finally, the structure is finished with a 50-nm-thick p-type Al 0.5 Ga 0.5 N (p = 5.0 × 10 16 cm −3 ) and a 150-nm-thick p-type GaN contact layer (p = 1.0 × 10 18 cm −3 ), as shown schematically in Fig.…”
mentioning
confidence: 99%