Study of mixing process of low temperature co-fired ceramics photocurable suspension for digital light processing stereolithography

Fernandes, Joana Gonçalves; Barcelona, P.; Blanes, Mireia; Padilla, José Antonio Samper; Ramos, F.; Cirera, A.; Xuriguera, E.

doi:10.1016/j.ceramint.2021.02.167

Cited by 10 publications

(3 citation statements)

References 23 publications

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“…A powder-to-resin weight ratio of 80:20 results in poor fluidity; therefore, the slurry may not be deposited and cast on the tape, thus no exposure curing experiment is performed. This is consistent with the findings of Fernandes et al study [ 16 ]. The maximum weight ratio of LTCC to resin to ensure good suspension in the slurry is 75 wt %.…”

Section: Resultssupporting

confidence: 94%

Development of a Novel Tape-Casting Multi-Slurry 3D Printing Technology to Fabricate the Ceramic/Metal Part

2023

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Printing ceramic/metal parts increases the number of applications in additive manufacturing technology, but printing different materials on the same object with different mechanical properties will increase the difficulty of printing. Multi-material additive manufacturing technology is a solution. This study develops a novel tape-casting 3D printing technology that uses bottom-up photopolymerization to fabricate the green body for low-temperature co-fired ceramics (LTCC) that consist of ceramic and copper. The composition of ceramic and copper slurries is optimized to allow printing without delamination and sintering without cracks. Unlike traditional tape-casting processing, the proposed method deposits two slurries on demand on a transparent film, scrapes it flat, then photopolymerization is induced using a liquid crystal displayer to project the layer pattern beneath the film. The experimental results show that both slurries have good bonding strength, with a weight ratio of powder to resin of 70:30, and print a U-shaped copper volume as a circuit within the LTCC green body. A three-stage sintering parameter is derived using thermogravimetric analysis to ensure good mechanical properties for the sintered part. The SEM images show that the ceramic/copper interface of the LTCC sintered part is well-bonded. The average hardness and flexural strength of the sintered ceramic are 537.1 HV and 126.61 MPa, respectively. Volume shrinkage for the LTCC slurry is 67.97%, which is comparable to the value for a copper slurry of 68.85%. The electrical resistance of the printed copper circuit is 0.175 Ω, which is slightly greater than the theoretical value, hence it has good electrical conductivity. The proposed tape-casting 3D printer is used to print an LTCC benchmark. The sintered benchmark part is validated for the application in the LTCC application.

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Section: Resultssupporting

confidence: 94%

Development of a Novel Tape-Casting Multi-Slurry 3D Printing Technology to Fabricate the Ceramic/Metal Part

2023

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“…The high rates of productivity in the wireless communication industries, which are increasingly inclined toward miniaturization and integration, are the main causes of the scientific and industrial community’s recent preoccupation with LTCC technology [ 10 ]. However, metal electrodes must be chemically compatible with the LTCC composites, and their sintering temperature must be lower than the melting points of highly conductive electrodes such as Ag or Au [ 11 , 12 , 13 , 14 , 15 , 16 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Al2O3 and ZrO2 Filler Material on the Microstructural, Thermal and Dielectric Properties of Borosilicate Glass-Ceramics

et al. 2023

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Various glass-ceramics are widely used or considered for use as components of microelectronic materials due to their promising properties. In this study, borosilicate glass was prepared using the powder metallurgical route and then mixed with different amounts of Al2O3 and ZrO2 filler materials. Glass-ceramics are produced by high-energy ball milling and conventional sintering process under Ar or air. In this study, the effects of different filler materials and different atmospheres on the microstructural, thermal and dielectric properties were investigated. The data showed that ZrO2 filler material led to better results than Al2O3 under identical working conditions and similar composite structures. ZrO2 filler material significantly enhanced the densification process of glass-ceramics (100% relative density) and led to a thermal conductivity of 2.904 W/K.m, a dielectric constant of 3.97 (at 5 MHz) and a dielectric loss of 0.0340 (at 5 MHz) for the glass with 30 wt.% ZrO2 sample. This paper suggests that prepared borosilicate glass-ceramics have strong sinterability, high thermal conductivity, and low dielectric constants, making them promising candidates for microelectronic devices.

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“…Thus, the miniaturization and integration of electronic devices are receiving increasing attention [1][2][3][4][5][6][7][8][9]. Various glasses and glass-ceramics are widely used or considered for use as components of electronic materials due to their promising properties [10][11][12][13][14]. Porosity, hardness, strength, translucency, opacity, thermal expansion, temperature stability, chemical durability, thermal conductivity, dielectric loss, and resistivity can be designed and tailored in glass-ceramics [2,3,10,13].…”

Section: Introductionmentioning

confidence: 99%

Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions

Arıbuğa

Akkasoglu²,

Çiçek

et al. 2022

Materials

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With the rapid development of the microelectronics industry, many efforts have been made to improve glass-ceramics’ sinterability, thermal conductivity, and dielectric properties, which are essential components of electronic materials. In this study, low-alkali borosilicate glass-ceramics with PVA addition and glass-BN composites were prepared and successfully sintered at 770 °C. The phase composition, density, microstructure, thermal conductivity, and dielectric constant were investigated. It was shown that PVA addition contributes to the densification process of glass-ceramics (~88% relative density, with closed/open pores in the microstructure) and improves the thermal conductivity of glass material from 1.489 to 2.453 W/K.m. On the other hand, increasing BN addition improves microstructures by decreasing porosities and thus increasing relative densities. A glass-12 wt. % BN composite sample exhibited almost full densification after sintering and presented apparent and open pores of 2.6 and 0.08%, respectively. A high thermal conductivity value of 3.955 W/K.m and a low dielectric constant of 3.00 (at 5 MHz) were observed in this material. Overall, the resulting glass-ceramic samples showed dielectric constants in the range of 2.40–4.43, providing a potential candidate for various electronic applications.

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Study of mixing process of low temperature co-fired ceramics photocurable suspension for digital light processing stereolithography

Cited by 10 publications

References 23 publications

Development of a Novel Tape-Casting Multi-Slurry 3D Printing Technology to Fabricate the Ceramic/Metal Part

Development of a Novel Tape-Casting Multi-Slurry 3D Printing Technology to Fabricate the Ceramic/Metal Part

Effect of Al2O3 and ZrO2 Filler Material on the Microstructural, Thermal and Dielectric Properties of Borosilicate Glass-Ceramics

Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions

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