Study of Ni-W alloy as a MEMS Material

Ikeda, Hidehiro; Ioku, Sunao; Fujita, Takayuki; Maenaka, Kazusuke; Maeda, Muneo

doi:10.1541/ieejsmas.119.598

Cited by 8 publications

(8 citation statements)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…%. For the reported Ni-W films, 17,18,22) the content ratio of W in the Ni-W mold was high. Thus, we concluded that Ni-W molds are stable for glass micro-press molding.…”

Section: Glass Press Molding and Physical Property Measurementmentioning

confidence: 92%

“…It is difficult to electrodeposit a thick layer of the Ni-W alloy owing to the tensile residual stress. 18) Thus, a thin Ni-W film was electrodeposited on the substrate. The substrate was 30 mm in diameter and 2 mm in thickness with the low coefficient of the expansion alloy (Incoloy909).…”

Section: Fabrication Process Of the Ni-w Electroformed Moldmentioning

confidence: 99%

“…Hydrogen absorption 26) is proposed as the leading mechanism that causes crystal lattice contraction. In Ni-W electroforming, because abundant hydrogen gas is produced, 18) Ni-W patterns absorbing hydrogen gas are subjected to tensile residual stress. As a result, Ni-W patterns squeezed SU-8 patterns.…”

Section: Glass Press Molding and Physical Property Measurementmentioning

confidence: 99%

See 2 more Smart Citations

Property Variation of Ni–W Electroformed Mold for Micro-Press Molding

Yasui

Kaneko

Takahashi

et al. 2013

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

We proposed a simple method to fabricate a Ni–W electroformed mold for glass micro-press molding. For example, borosilicate glass (D263) was molded using the Ni–W electroformed mold. A Ni–W electroformed mold with a fine line was fabricated by photolithography and electroforming technology. Additionally, the Ni–W electroformed mold did not require a release layer. As the result of molding D263 at 883 K, the minimum pitch of the glass pattern was the same as that of the Ni–W electroformed mold. We argue that the crystallization of amorphous Ni–W occurred with the activation energy derived from the heating of micro-press molding. The heating temperature was 833 K. Additionally, the release characteristics of a Ni–W film were improved by increasing the percentage of W. In terms of the thermochemical stability and high content rate of W, we indicated that Ni–W electroformed molds can be used repeatedly for glass micro-press molding.

show abstract

“…%. For the reported Ni-W films, 17,18,22) the content ratio of W in the Ni-W mold was high. Thus, we concluded that Ni-W molds are stable for glass micro-press molding.…”

Section: Glass Press Molding and Physical Property Measurementmentioning

confidence: 92%

Section: Fabrication Process Of the Ni-w Electroformed Moldmentioning

confidence: 99%

Section: Glass Press Molding and Physical Property Measurementmentioning

confidence: 99%

See 1 more Smart Citation

Property Variation of Ni–W Electroformed Mold for Micro-Press Molding

Yasui

Kaneko

Takahashi

et al. 2013

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

show abstract

“…Here, we used an electroplating solution to obtain a high tungsten content; 26 the chemical composition of the solution is presented in Table I. A Pt foil and a Si substrate both of size 20 × 20 mm 2 were used as an anode and a cathode, respectively. A Si substrate has a seed layer of Cr/Au with thicknesses of 10 and 50 nm, respectively.…”

Section: Electroplatingmentioning

confidence: 99%

“…Hence, these films can be used in MEMS devices. 26 Consequently, we focused here on NiW alloy. The W content in electroplated NiW films can be controlled by adjusting the electroplating conditions.…”

Section: Introductionmentioning

confidence: 99%

Microfabrication of a Free-Standing NiW Alloy Film as a Wavelength-Selective Surface

Nashun¹,

Iwami²,

Umeda³

2015

j comput theor nanosci

View full text Add to dashboard Cite

We here report a method for fabricating a heat-resistant alloy based on NiW electroplating and silicon lost-molding processes. A periodic micropattern was fabricated on a silicon mold by electronbeam lithography and deep reactive-ion etching. A heat-resistive NiW alloy film with a thickness of 2.1 m was subsequently electroplated onto an Au seed layer deposited on the silicon mold, following which the silicon mold was finally etched, and a free-standing NiW alloy film was released. The NiW film was characterized by energy-dispersive X-ray spectrometry and Fourier transform infrared spectrophotometer. The film contained 24.6 at% tungsten, and its melting point was estimated to be 1675 C. Modification of the film's spectral reflectivity was confirmed, and an emission peak at 1.4 m was observed; This emission wavelength agrees well with the absorption band of a conventional infrared photovoltaic cell of Ge. Thermophotovoltaic power generation was demonstrated using a Ge photodiode and Joule heating of the micropatterned NiW film, and a radiation efficiency of 9 13 × 10 −6 was achieved.

show abstract

Formation of Nanofibers in Thin Layers of Amorphous W Alloys with Ni, Co, and Fe Obtained by Electrodeposition

Donten

Stojek

Cesiulis

2003

J. Electrochem. Soc.

View full text Add to dashboard Cite

Scanning tunneling microscopy ͑STM͒ experiments supported by scanning electron microscopy ͑SEM͒ pictures and X-ray diffractometry indicate that all electrodeposited amorphous alloys of tungsten with the iron-group metals are in fact of nanofibrous structure. It has been shown that the nanofibers grow perpendicularly to the copper support and, as the thickness of the alloy microlayer grows, group into well-packed bundles. The thickness of the fibers, for 79:21 Ni-W and 75:25 Co-W determined from the STM images, equals 50 Å. This number correlates well with the average grain size (40-55 Å) calculated, using the Scherrer formula, from the peak broadening seen at the X-ray spectrograms.

show abstract

Study of Ni-W alloy as a MEMS Material

Cited by 8 publications

References 3 publications

Property Variation of Ni–W Electroformed Mold for Micro-Press Molding

Property Variation of Ni–W Electroformed Mold for Micro-Press Molding

Microfabrication of a Free-Standing NiW Alloy Film as a Wavelength-Selective Surface

Formation of Nanofibers in Thin Layers of Amorphous W Alloys with Ni, Co, and Fe Obtained by Electrodeposition

Contact Info

Product

Resources

About