Study of Residual Stress Compensation in Continuous Membrane Micromirrors Based on Surface Micromachining Processes

Wang, Qiang; Wang, Weimin; Fang, Liang; Zhou, Chenyang; Fan, Bin

doi:10.3390/coatings11030289

Cited by 3 publications

(3 citation statements)

References 29 publications

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“…In contrast, if the residual compressive stress exceeds the Euler buckling limit, the membrane buckles. The Euler buckling limit of a doubly fixed beam is given by 23 where H is the thickness of the beam. According to Eq.…”

Section: Resultsmentioning

confidence: 99%

A new fabrication method for enhancing the yield of linear micromirror arrays assisted by temporary anchors

Xiao,

Mao,

Shi

et al. 2024

Microsyst Nanoeng

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As one of the most common spatial light modulators, linear micromirror arrays (MMAs) based on microelectromechanical system (MEMS) processes are currently utilized in many fields. However, two crucial challenges exist in the fabrication of such devices: the adhesion of silicon microstructures caused by anodic bonding and the destruction of the suspended silicon film due to residual stress. To solve these issues, an innovative processing method assisted by temporary anchors is presented. This approach effectively reduces the span of silicon microstructures and improves the Euler buckling limit of the silicon film. Importantly, these temporary anchors are strategically placed within the primary etching areas, enabling easy removal without additional processing steps. As a result, we successfully achieved wafer-level, high-yield manufacturing of linear MMAs with a filling factor as high as 95.1%. Demonstrating superior capabilities to those of original MMAs, our enhanced version boasts a total of 60 linear micromirror elements, each featuring a length-to-width ratio of 52.6, and the entire optical aperture measures 5 mm × 6 mm. The linear MMA exhibits an optical deflection angle of 20.4° at 110 Vdc while maintaining exceptional deflection flatness and uniformity. This study offers a viable approach for the design and fabrication of thin-film MEMS devices with high yields, and the proposed MMA is promising as a replacement for digital micromirror devices (DMDs, by TI Corp.) in fields such as spectral imaging and optical communication.

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Section: Resultsmentioning

confidence: 99%

A new fabrication method for enhancing the yield of linear micromirror arrays assisted by temporary anchors

Xiao,

Mao,

Shi

et al. 2024

Microsyst Nanoeng

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show abstract

“…On the contrary, if the residual compressive stress exceeds the Euler buckling limit, the membrane will buckle. The Euler buckling limit of a doubly-xed beam is given by 21 3 where H is thickness of the beam. According to Eq.…”

Section: Resultsmentioning

confidence: 99%

A new fabrication method for enhancing the yield of linear micromirror arrays assisted by temporary anchors

Yu,

Xiao,

Mao

et al. 2023

Preprint

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As one of the most common spatial light modulators, the linear micromirror array (MMA) based on the microelectromechanical system (MEMS) process is utilized in many fields nowadays. However, two crucial challenges exist to fabricate such devices: adhesion of silicon microstructures caused by anodic bonding and destruction of the suspended silicon film due to residual stress. To solve these issues, an innovative processing method assisted by temporary anchors is proposed. It effectively reduces the span of silicon microstructures and improves the Euler buckling limit of the silicon film. Importantly, these temporary anchors are strategically placed within the primary etching areas, requiring no additional processing steps for easy removal. As a result, we successfully achieve wafer-level, high-yield manufacturing of linear MMAs with filling factor as high as of 95.1%. Compared to the original MMA, this enhanced version now boasts a total of 60 linear micromirror elements, each featuring a length-to-width ratio of 52.6, and the entire optical aperture measures 5 mm × 6 mm. The linear MMA exhibits optical deflection angle of 20.4° at 110 Vdc while maintaining exceptional deflection flatness and uniformity. This study offers a viable approach for design and fabrication of thin-film MEMS devices with high yields, and the proposed MMA holds promise as a replacement of the digital micromirror device (DMD, by TI Corp.) in such fields as spectral imaging and optical communication.

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“…Front-side etching of suspended structures is usually realized by a surface micromachining process [1][2][3][4]. Sacrificial * Author to whom any correspondence should be addressed.…”

Section: Introductionmentioning

confidence: 99%

Front-side Releasing <110> Oriented Clamped-clamped Beams for Piezoresistive Sensors

Han¹,

Sun²

2023

J. Micromech. Microeng.

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Front-side releasing suspended structures by bulk micromachining process have the advantages of simplifying vacuum or hermetic packaging process and reducing squeezes-film damping. This paper study the effect of doping concentration on the etching rate of (111) plane. The experimental results show that increasing the boron doping concentration (but less than the self-stop etching concentration) significantly increases the etching rate of (111) plane and the etching rate ratio of (111) and (100) planes. This phenomenon is used to speed up the undercutting and release <110> oriented clamped-clamped beams, which can be used as piezoresistive sensitive elements. The etching depth when microbeams are just released and the silicon wedges under single beams, double beams and triple beams disappear is deduced and verified by experiments. It has a certain guiding significance for designing piezoresistive sensors.

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Study of Residual Stress Compensation in Continuous Membrane Micromirrors Based on Surface Micromachining Processes

Cited by 3 publications

References 29 publications

A new fabrication method for enhancing the yield of linear micromirror arrays assisted by temporary anchors

A new fabrication method for enhancing the yield of linear micromirror arrays assisted by temporary anchors

A new fabrication method for enhancing the yield of linear micromirror arrays assisted by temporary anchors

Front-side Releasing <110> Oriented Clamped-clamped Beams for Piezoresistive Sensors

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