Study of swing potential on deep submicron on-chip interconnect

Optimal cascade lumped model of deep submicron on-chip interconnect with distributed parameters

“…Downscaling implies that operation conditions are pushed to limits where, without precautions, failure mechanisms, such as electromigration, stress voiding, extrusion, will be ubiquitous [1]. Besides the physical damage mechanisms, the specific precautions referring to process conditions, the use of alternative materials and designs as well as application conditions need be taken into account [1][2][3]. Therefore, two areas may be identified -the modeling of the processing based on which the modeling of the performance of the back-end architectures and the modeling of application conditions such as operation frequency, which this work addresses.…”