Study of the Curing Kinetics toward Development of Fast-Curing Epoxy Resins

Lakho, Dildar Ali; Yao, Donggang; Cho, Kyonghoon; Ishaq, Muhammad; Wang, Youjiang

doi:10.1080/03602559.2016.1185623

Cited by 38 publications

(24 citation statements)

References 6 publications

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“…As shown in table 2 , the peak curing temperature shifted with different heating rates. With an increase in heating rate, the initial and peak temperature were higher, the curing time could be reduced greatly and have a broader range of curing temperature, because the thermal effect per unit time was increased, it could have a greater thermal inertia, and the onset and peak temperature deviated to high temperature direction with an increase in heating rate [ 9 ].…”

Section: Resultsmentioning

confidence: 99%

“…Generally, resin curing time can be lowered by introducing and/or improving the catalytic behaviour of epoxy cross-linking with the curing agent or accelerator [ 9 ]. Many different kinds of curing agents or accelerators are applied to epoxy resins, and they are mainly divided into phenol formaldehyde resins, acid anhydrides, amines and imidazoles [ 3 , 10 ].…”

Section: Introductionmentioning

confidence: 99%

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Preparation and characterization of fast-curing powder epoxy adhesive at middle temperature

Yang

Liu

et al. 2018

R. Soc. open sci.

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At present, the disadvantage of powder epoxy adhesive is the limited application area. In order to widen the application range of powder epoxy adhesive from heat-resistant substrates (such as metals) to heat-sensitive substrates (such as plastic products, cardboard and wood), it is necessary to decrease the curing temperature. In this article, a series of fast-curing powder epoxy adhesives were prepared by the melt blending method with bisphenol A epoxy resin (E-20), hexamethylenetetramine (HMTA) as a curing agent and 2-methylimidazole (2-MI) as an accelerant. The structure and properties of the E-20/HMTA/2-MI systems were characterized by Fourier transform infrared, thermogravimetric analysis, dynamic mechanical analyser and differential scanning calorimetry (DSC). 2-MI added into the E-20/HMTA systems can simultaneously enhance toughness, tensile strength, glass transition temperature (Tg) and thermal stability in comparison with the E-20/HMTA systems. The best mechanical properties were obtained at 100/8/0.6 weight ratio of the E-20/HMTA/2-MI systems. DSC experiments revealed that the exothermic peak of the E-20/HMTA/2-MI system was about 55°C lower than that of the E-20/HMTA system. The activation energy of the cure reaction was determined by both Kissinger's and Ozawa's methods at any heating rates. The activation energy and pre-exponential factor were about 100.3 kJ mol−1 and 3.57 × 1011 s−1, respectively. According to the KAS method, the curing time of the E-20/HMTA/2-MI systems was predicted by evaluating the relationship between temperature and curing time.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Preparation and characterization of fast-curing powder epoxy adhesive at middle temperature

Yang

Liu

et al. 2018

R. Soc. open sci.

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“…Dogbone specimens with gauge dimensions of 42×4×2 mm 3 were used for the evaluation of the tensile behavior of the prepared samples before and after the combined UV exposure. Three to five samples were tensioned at a crosshead speed of 10 mm/min using a mini-tester (Ernest F. Fullam, Inc. New York, US) with a 1000 N load cell.…”

Section: Mechanical Testingmentioning

confidence: 99%

“…Typically in a two-component system, this occurs by allowing the resin to react with the hardener for several hours depending on the chemistry of the system and the applied temperature. In order to expedite processing, a new class of resin systems, namely fast curing ones, has been introduced by the chemical industry [3][4][5][6][7][8][9][10][11]. The target of the resin industry is to design fast curing systems that possess low viscosity, long pot life, and satisfactory performance.…”

Section: Introductionmentioning

confidence: 99%

Fast curing versus conventional resins – degradation due to hygrothermal and UV exposure

Barkoula¹,

Karabela²,

Zafeiropoulos³

et al. 2020

Express Polym. Lett.

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In the current paper, three resin systems are investigated, the first is a high temperature fast curing system, the second is a high-temperature system that requires several hours to cure and the third is a slow room temperature curing system. All systems are exposed to hygrothermal and combined moisture/temperature/UV protocols, and their durability is assessed using Fourier transform infrared (FTIR) spectroscopy, mechanical and thermomechanical characterization. The conventional slow curing system presents a wide distribution of polymer chains that leads in excess free volume/increased susceptibility to water. The medium curing system is more homogenous and shows lower absorption profiles. The fast curing system shows two network domains, one that is more crosslinked and contributes towards higher free volume/water absorption and the other that is partially cured and supports chain scission/leaching processes during exposure. Continuation of crosslinking prevails in conventional resins upon hygrothermal and combined UV exposure. At the same time antagonistic effects (i.e. continuation of the crosslinking process versus plasticization, chain scission, and leaching) are observed in medium curing and fast curing systems upon exposure.

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“…The resin system could be cured in 5 min at 120 °C. Lakho et al investigated the cure kinetics of fast curing epoxy systems for rapid RTM molding. Triethylenetetramine was used as a curing agent and 1‐benzyl‐2‐methylimidazole served as a catalyst.…”

Section: Introductionmentioning

confidence: 99%

Curing kinetics and mechanical properties of fast curing epoxy resins with isophorone diamine and N‐(3‐aminopropyl)‐imidazole

Zhao

Huang

Song

et al. 2019

J of Applied Polymer Sci

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Fast curing epoxy resins were prepared by the reactions of diglycidyl ether of bisphenol A with isophorone diamine (IPD) and N-(3-aminopropyl)-imidazole (API), and their curing kinetics and mechanical properties influenced by IPD content were also investigated. The analysis of curing kinetics was based on the nonisothermal differential scanning calorimetry (DSC) data with the typical Kissinger, Ozawa, and Flynn-Wall-Ozawa models, respectively. The glass-transition temperature was also measured by the same technique. Additionally, the mechanical properties including flexural, impact, and tensile performances were tested, and the curing time was estimated by isothermal DSC. The degree of cure (α) dependency of activation energy (E a ) revealed the complexity of curing reaction. Detailed analysis of the curing kinetics at the molecular level indicated that the dependence of E a on the α was a combined effect of addition reaction, autocatalytic reaction, viscosity, and steric hindrance. From the nonisothermal curves, the curing reaction mechanism could be proposed according to the increasingly obvious low temperature peaks generated by the addition reaction of epoxy group with the primary amines in API and IPD molecules. Using the preferred resin formulation, the resin system could be cured within 10 min at 120 C with a relatively good mechanical performance.

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Study of the Curing Kinetics toward Development of Fast-Curing Epoxy Resins

Cited by 38 publications

References 6 publications

Preparation and characterization of fast-curing powder epoxy adhesive at middle temperature

Preparation and characterization of fast-curing powder epoxy adhesive at middle temperature

Fast curing versus conventional resins – degradation due to hygrothermal and UV exposure

Curing kinetics and mechanical properties of fast curing epoxy resins with isophorone diamine and N‐(3‐aminopropyl)‐imidazole

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