Study of the self-alignment of no-flow underfill for micro-BGA assembly

Chan, Y.C.; Tu, P.L.; Hung, Kevin

doi:10.1016/s0026-2714(01)00041-5

Cited by 16 publications

(4 citation statements)

References 15 publications

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“…Compared to the conventional solder self-alignment of micro-BGA (Ball Grid Array, BGA), where the allowed initial bias is known to be around 50% of the size of one pad [34], the proposed technique enables self-alignment at much larger initial misalignments.…”

Section: Influence Of the Gap With Biases In One Axismentioning

confidence: 99%

Self-alignment of RFID dies on four-pad patterns with water droplet for sparse self-assembly

Chang¹,

Routa²,

Sariola³

et al. 2011

J. Micromech. Microeng.

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This paper reports an in-depth study of a water-droplet-assisted self-alignment technique that self-aligns radio frequency identification (RFID) dies on four-pad patterns. The segmented structure of four hydrophilic pads on a hydrophobic substrate brings freedom to the design of the electrical functionality and the surface functionality. The paper investigates the influence of the key parameters that may affect the self-alignment in theory and experiment. The theoretical model justifies that RFID dies can be reliably aligned on the segmented four-pad pattern even when the initial placement error is as large as 50% of the size of the die and the gap between the four pads is about 10% of the size of the die. A method has been introduced to estimate the sufficient droplet volume for self-alignment. A series of experiments have been carried out to verify the results of the model. The experiments indicate that the self-alignment between the 730 × 730 μm RFID dies and the pattern occurs reliably when the releasing bias between the RFID die and antenna is less than 400 μm for patterns with 50 and 100 μm gaps, and successful self-alignment is possible even with greater bias of 500 μm.

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Section: Influence Of the Gap With Biases In One Axismentioning

confidence: 99%

Self-alignment of RFID dies on four-pad patterns with water droplet for sparse self-assembly

Chang¹,

Routa²,

Sariola³

et al. 2011

J. Micromech. Microeng.

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“…Consequently the automated rework process and requirements for automation have also changed. The use of area array or advanced packaging SMCs is expected to increase (Lau and Alto, 1997;Bird, 1999;Chan et al, 2001;Yunus et al, 2003). Increasing adoption of lead free solders has also resulting in higher reflow temperatures.…”

Section: Introductionmentioning

confidence: 99%

Design of a flexible assembly and remanufacturing cell for advanced SM components: selection of cell design concept based on reflow tools

Geren

Çakirca²,

Bayramoğlu³

2006

Soldering &Amp; Surface Mount Technology

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Purpose -To design a flexible integrated robotic assembly and rework (remanufacturing) cell for assembly, selective assembly and rework of advanced surface mount components (SMCs) using the generic methodology developed in this paper. Design/methodology/approach -Manual rework procedures are investigated for all advanced SMCs. General and specific component-related rework considerations are obtained and necessary tooling candidates for automation are determined. This is followed by determination of the specific automated rework procedure and selection of suitable tooling for automated robotic rework and generation and evaluation of design concepts. Findings -The developed methodology, which considers the reflow tool at the centre of the development process, has worked well in designing a flexible integrated robotic assembly and rework cell.Practical implications -This study identified the rework requirements for advanced SMCs, the essential features for rework reflow tools, criteria for comparing reflow tools, and a generic procedure for design and concept selection. Originality/value -It provides valuable knowledge for designers of flexible integrated robotic assembly and rework cells for assembly, selective assembly and rework of advanced SMCs.

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“…Base on this trend, the use of two-dimensional (2D) surface-mount device (SMD) packages such as the ball grid array (BGA), chip scale package (CSP), wafer level package (WLP) and multi-chip module (MCM) has increased [1][2][3]. However, the 2D package technique has limitations for next-generation packaging trends because of interconnect scaling problems [4].…”

Section: Introductionmentioning

confidence: 99%

Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy fillers

Lee

Yim

Shin

et al. 2016

J Mater Sci: Mater Electron

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A novel three-dimensional (3D) multi-layer through-hole filling process using solderable polymer composites (SPCs) was developed to overcome several limitations of the conventional 3D package technique. To investigate the multi-layer through-hole filling properties of SPCs, SPCs with functionalized polymer composite and low-melting-point-alloy (LMPA) fillers were formulated, and a multi-layer through-hole filling test was conducted under atmospheric pressure and decompression reflow conditions. The results indicated that the multi-layer through-hole filling assemblies under the atmospheric pressure reflow condition have weak through-hole filling and interlayer interconnection properties because of the weak elimination of residual polymer composite and voids within the through-hole. Meanwhile, the multi-layer through-hole filling assemblies reflowed under the decompression condition showed improved through-hole filling properties because of the favorable elimination of polymer composite and voids within the through-hole and the excellent wetting behavior of molten fillers. The corresponding electrodes between the stacked boards were electrically interconnected by the proper selective wetting behavior of molten LMPA, and the spaces between stacked boards were underfilled by the cured polymer composite.

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Study of the self-alignment of no-flow underfill for micro-BGA assembly

Cited by 16 publications

References 15 publications

Self-alignment of RFID dies on four-pad patterns with water droplet for sparse self-assembly

Self-alignment of RFID dies on four-pad patterns with water droplet for sparse self-assembly

Design of a flexible assembly and remanufacturing cell for advanced SM components: selection of cell design concept based on reflow tools

Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy fillers

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