Study on ductile mode machining of single-crystal silicon by mechanical machining

Choi, Daehee; Lee, Je-Ryung; Kang, Namgoo; Je, Tae-Jin; Kim, Ju‐Young; Jeon, Eun‐chae

doi:10.1016/j.ijmachtools.2016.10.006

Cited by 45 publications

(4 citation statements)

References 20 publications

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“…As other cutting parameters unchanged, the increase of cutting depth leads to the increasing number of atoms acted by the tool, which need to overcome more binding force obviously [41]. According to fracture mechanics [42], the fracture energy is equivalent to the surface energy newly generated by the mechanical machining in case of a perfectly brittle material. The newly created surface and corresponding number of broken atomic bonds by brittle fracture is larger than that in ductile mode.…”

Section: Cutting Force Measurement and Its Standard Uncertainty 331 C...mentioning

confidence: 99%

In situ investigation of nanometric cutting of 3C-SiC using scanning electron microscope

Tian

Liu

et al. 2021

Int J Adv Manuf Technol

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Experimentally revealing the nanometric deformation behavior of 3C-SiC is challenging due to its ultra-small feature size for brittle-to-ductile transition. In the present work, we elucidated the nanometric cutting mechanisms of 3C-SiC by performing in-situ nanometric cutting experiments under scanning electron microscope (SEM), as well as post-characterization by electron back-scattered diffraction (EBSD) and transmission electron microscopy (TEM). In particular, a new method based on the combination of image processing technology and SEM online observation was proposed to achieve in-situ measurement of cutting force with an uncertainty less than 1 mN. Furthermore, the cutting cross-section was characterized by atomic force microscope (AFM) to access the specific cutting energy. The results revealed that the specific cutting energy increase non-linearly with the decrease of cutting depth due to the size effect of cutting tool in nanometric cutting. The high-pressure phase transformation (HPPT) may play the major role in 3C-SiC ductile machining under the parameters of this experiment.

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Section: Cutting Force Measurement and Its Standard Uncertainty 331 C...mentioning

confidence: 99%

In situ investigation of nanometric cutting of 3C-SiC using scanning electron microscope

Tian

Liu

et al. 2021

Int J Adv Manuf Technol

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“…It means that the cutting speed contributes less to the grinding process in the plastic flow removal mode. Choi et al [12] implemented a nano-scratching experiment on a monocrystalline silicon surface; they concluded that the cutting speed did not vary the brittleductile transition point or the machining mode in a general condition of mechanical machining with constant cutting depth. However, the cutting force at the critical point increased with the increment of thrust force per unit length along the scratch direction.…”

Section: Introductionmentioning

confidence: 99%

Sensitivity analysis of the surface integrity of monocrystalline silicon to grinding speed with same grain depth-of-cut

et al. 2020

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Mechanisms for removal of materials during the grinding process of monocrystalline silicon have been extensively studied in the past several decades. However, debates over whether the cutting speed significantly affects the surface integrity are ongoing. To address this debate, this study comprehensively investigates the effects of cutting speed on surface roughness, subsurface damage, residual stress, and grinding force for a constant grain depth-of-cut. The results illustrate that the changes in the surface roughness and subsurface damage relative to the grinding speed are less obvious when the material is removed in ductile-mode as opposed to in the brittle-ductile mixed mode. A notable finding is that there is no positive correlation between grinding force and surface integrity. The results of this study could be useful for further investigations on fundamental and technical analysis of the precision grinding of brittle materials.

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“…In order to prevent the damage induced by machining, the ductile 1 Author to whom any correspondence should be addressed. mode cutting of single-crystal silicon has been widely studied [1][2][3][4]. The ductile cutting of silicon depends on its phase transformation under high hydrostatic pressure.…”

Section: Introductionmentioning

confidence: 99%

Prediction of critical undeformed chip thickness for ductile mode to brittle transition in the cutting of single-crystal silicon

Yao¹,

Zhang²,

Jiang³

et al. 2020

Semicond. Sci. Technol.

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In order to achieve the ductile mode cutting of silicon and avoid the generation of subsurface crack damage, the undeformed chip thickness in the diamond cutting process must be controlled below the critical value. Therefore, the critical undeformed chip thickness (CUCT) for the ductile mode cutting of silicon is studied in this paper for guiding the selection of cutting parameters in the diamond cutting of silicon. Considering the anisotropy of single-crystal silicon, the prediction method of the CUCT in the ductile cutting of silicon is proposed on the basis of calculating the anisotropic fracture strength of silicon and subsurface stress distribution induced by the cutting force. Moreover, the influence of the anisotropy of single-crystal silicon, cutting tool parameters and friction coefficient in the cutting process on the CUCT are discussed, respectively. The results show that the anisotropic CUCT depends on the cutting surfaces and cutting directions. In addition, the diamond cutting tool with a negative rake angle of −40 • is generally suitable for ductile cutting on the silicon (001), ( 110) and ( 111) surface when the friction coefficient in the cutting process is in the range of 0.05-0.30. Under this cutting condition, the minimum CUCT on the silicon (001), ( 110) and (111) surface is in the range of 150 ∼ 250 nm, 160 ∼ 290 nm and 150 ∼ 250 nm, respectively. The lower limit of the minimum CUCT on the three surfaces corresponds to the friction coefficient of 0.30 in the cutting process, and the upper limit corresponds to the friction coefficient of 0.05. Furthermore, a sharp-nosed cutting tool is also beneficial to improve the CUCT in the cutting process.

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Study on ductile mode machining of single-crystal silicon by mechanical machining

Cited by 45 publications

References 20 publications

In situ investigation of nanometric cutting of 3C-SiC using scanning electron microscope

In situ investigation of nanometric cutting of 3C-SiC using scanning electron microscope

Sensitivity analysis of the surface integrity of monocrystalline silicon to grinding speed with same grain depth-of-cut

Prediction of critical undeformed chip thickness for ductile mode to brittle transition in the cutting of single-crystal silicon

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