2020
DOI: 10.3390/mi11050528
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Study on Electrical Explosion Properties of Cu/Ni Multilayer Exploding Foil Prepared by Magnetron Sputtering and Electroplating

Abstract: The purpose of this study was to investigate the effects of the microstructure and properties of Cu/Ni multilayer films prepared by magnetron sputtering and electroplating on the electrical explosion performance of the films. In this study, Cu/Ni multilayer films of the same thickness were prepared by electroplating (EP) and magnetron sputtering (MS), and their morphology and crystal structure were characterized by scanning electron microscope (SEM) and transmission electron microscope (TEM). XRD was used to o… Show more

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Cited by 5 publications
(3 citation statements)
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“…According to the literature [15,16], the velocity measurement of the flyer is carried out by using PDT. In the PDT speed measurement system, the fiber with a core diameter of 105 μm is used to output a laser and receive a reflected optical signal.…”
Section: Velocity Measuring Test Device Of Flyermentioning
confidence: 99%
See 1 more Smart Citation
“…According to the literature [15,16], the velocity measurement of the flyer is carried out by using PDT. In the PDT speed measurement system, the fiber with a core diameter of 105 μm is used to output a laser and receive a reflected optical signal.…”
Section: Velocity Measuring Test Device Of Flyermentioning
confidence: 99%
“…At present, the theoretical and experimental researches on the flyer velocity of exploding foil initiators is relatively mature, and a variety of velocity testing techniques of small flyers have been mastered. Moreover, the various parameters of the exploding foil initiator on the flyer velocity have also been investigated from a macro point of view [15][16][17]. The macroscopic properties of materials depend not only on their chemical composition, but also, to a greater extent, on their micromorphology and grain size [18,19].…”
Section: Introductionmentioning
confidence: 99%
“…Wang and co-workers [ 21 ] present exploding foil microinitiators completely fabricated by MEMS-based engineering, which can be triggered by Metal-Oxide Semiconductor-Controlled Thyristor. Additionally, Lei and co-workers [ 22 ] integrate Cu/Ni Multilayer Exploding Foil on MEMS chips by Magnetron Sputtering and Electroplating.…”
mentioning
confidence: 99%