2019
DOI: 10.1007/s42452-019-0200-6
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Study on epoxy resin-based thermal adhesive filled with hybrid expanded graphite and graphene nanoplatelet

Abstract: Reinforced epoxy composite adhesives of expanded graphite (EG) and graphene nanoplatelet (GNPs) were prepared by hand layup and mechanical mixing method. Disk-shaped epoxy composite samples with EG and GNP mixtures in varying ratios were prepared to measure the thermal conductivity (TC) enhancement. Thermal characterization testing data showed high thermal conductivity enhancement with three different hybrid filler concentrations of 10, 25, and 35 wt%, respectively. The highest thermal conductivity of 3.6 W/m … Show more

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Cited by 23 publications
(31 citation statements)
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“…However, the synergistic effect was low at high loading of GNP due to the agglomeration of GNP inside the epoxy matrix. 138 This finding agrees with the results of Levy et al, 139 where the high aspect ratio of the composite reduced the thermal conductivity due to the substantial increase in the composite viscosity and entrapped air bubbles in the composite. This finding indicates the poor surface contact and increased thermal resistance of the TIMs.…”
Section: Graphitesupporting
confidence: 91%
See 2 more Smart Citations
“…However, the synergistic effect was low at high loading of GNP due to the agglomeration of GNP inside the epoxy matrix. 138 This finding agrees with the results of Levy et al, 139 where the high aspect ratio of the composite reduced the thermal conductivity due to the substantial increase in the composite viscosity and entrapped air bubbles in the composite. This finding indicates the poor surface contact and increased thermal resistance of the TIMs.…”
Section: Graphitesupporting
confidence: 91%
“…Graphite is usually combined with graphene in fabricating composites. Kumar and coworkers studied on thermal adhesive of ER, which was contained hybrid expanded graphite (EG) and graphene nanoplatelets (GNP) to enhance the thermal conductivity of the adhesive. The study obtained an optimum thermal conductivity of 3.6 W (m K) –1 in 30 wt% EG and 5 wt% GNP.…”
Section: Carbon Allotrope Materials In Tims Applicationsupporting
confidence: 91%
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“…For the epoxy/MWCNTs composites, a sharp rise in temperature of 5% mass loss T 5% was observed from 300 • C for the pure epoxy resin E0 to 319 • C for the epoxy composite filled with 0.1 wt.% of MWCNTs. With a further increase in the content of MWCNTs to 0.5 wt.%, there was a slow increase in T 5% to 326 • C. The values of T 5% were high enough compared to epoxy composites based on expanded graphite and graphene nanoplatelets [45,46], taking into account relatively low concentrations of EG (E/1.0EG) and the increased T 5% (338 • C). Notation: T 5% , T 20% , T 50% , T 80% -temperatures (in • C), corresponding to 5%, 20%, 50%, and 80% mass loss of the sample, respectively.…”
Section: Thermal Oxidation Behaviormentioning
confidence: 97%
“…For this, high thermal conducting interface material between the heat source (chips or circuits) and the sink is placed as a packaging material to add strength as well as to remove heat from chips. 1,2 The other basic parameters for thermal interface materials (TIMs) are high thermal and chemical stability, low dimensional shrinkage and water absorption, low coefficient of expansion, and low dielectric properties including high TC. 3,4 Except high TC, epoxy resin demonstrates the above-mentioned properties.…”
Section: Introductionmentioning
confidence: 99%