Study on Insulation Breakdown Characteristics of Printed Circuit Board under Continuous Square Impulse Voltage

Abstract

The widely distributed interconnects in printed circuit boards (PCBs) easily couple with high voltage under the action of electromagnetic pulses, which leads to insulation failure. In this study, the dielectric breakdown characteristics of four typical PCBs are studied under continuous square impulse voltage conditions. First, the electric field distribution in the four electrode models is simulated with the ANSYS software (ANSYS Maxwell 17.0). Electric field simulation results show the weak area of electric field distribution. On this basis, the possible breakdown patterns of PCB are analyzed. Second, the influence of factors, such as temperature, pulse duty ratio, interconnect insulation distance, and air pressure, on PCB breakdown voltage is studied through a breakdown test on the PCBs. Results show that the discharge between the single-layer electrodes of the PCBs is surface discharge, and the breakdown is that of a “gas–solid composite medium”. Meanwhile, the breakdown of a double-layer PCB is solid breakdown. Finally, scanning electron microscopy (SEM) produced by Tescan (Brno, Czech Republic) is performed to study the carbonization channel after PCB breakdown. SEM results reveal that the PCB carbonization channel is influenced by temperature and pressure in varying degrees.

Paschen curve for a PCB trace in low vacuum

“…It's common mathematical expression [1] is written under uniform field assumption for two parallel conductive plates. There are some recent works where a non-uniform electrical filed is considered for several special conductor configurations and also for PCB traces in a vacuum with pressure up to 10 -1 mbar [2]. There are also reports about anomaly of Paschen curve behavior for uniform field, very low distances ( 10 um and closer) and low vacuums [3,4].…”