2018
DOI: 10.1016/j.vacuum.2017.11.018
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Study on SiO2 thin film modified by post hot isostatic pressing

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Cited by 11 publications
(6 citation statements)
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“…The container was degassed at 550 • C and then sealed by welding under a vacuum of 1 × 10 −3 Pa. their average sizes were 10 μm, 25 μm, and 50 μm, respectively. After vibration, the initial packing density of powder was 4.9 g/cm 3 . The container material was 45# low-carbon steel and its composition is shown in Table 2.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…The container was degassed at 550 • C and then sealed by welding under a vacuum of 1 × 10 −3 Pa. their average sizes were 10 μm, 25 μm, and 50 μm, respectively. After vibration, the initial packing density of powder was 4.9 g/cm 3 . The container material was 45# low-carbon steel and its composition is shown in Table 2.…”
Section: Methodsmentioning
confidence: 99%
“…Hot isostatic pressing (HIP) is a powerful process to densify metal powder into a desirable shape, microstructure, and properties. The relative density (RD) and distribution of an HIPed part are highly dependent on temperature [1,2], pressure [3][4][5], soaking time [6,7], and container geometry [8,9] since the densification process is primarily driven by elemental diffusion and the creep deformation of powders [10][11][12][13][14]. To densify it close to the theoretical density, in practice cases, a trial-and-error methodology is often carried out to obtain the optimized processing parameters and container geometry, which is highly costly and labor-intensive [15][16][17][18][19].…”
Section: Introductionmentioning
confidence: 99%
“…The pressure is applied from all directions equally, which makes the process "isostatic". The primary governing parameters of HIPing are inert atmosphere, temperature, pressure, and cycle time 27 .…”
Section: Introductionmentioning
confidence: 99%
“…SiO 2 thin films have many advantages, such as high light transmittance, good insulation, good dielectric properties, and strong corrosion resistance. At present, SiO 2 thin films have been widely used in optical film devices, electronic devices, integrated devices, sensors, and other fields [1][2][3][4][5][6]. However, several new applications for SiO 2 thin films will require conformal coverage (good conformality) of micro-and nano-scale features in the substrate.…”
Section: Introductionmentioning
confidence: 99%