2013
DOI: 10.1080/00986445.2012.721033
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Study on the Acetylene Hydrogenation Process for Ethylene Production: Simulation, Modification, and Optimization

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Cited by 12 publications
(12 citation statements)
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“…The kinetic parameters of this reaction show some difference between phenylacetylene semihydrogenation and acetylene semihydrogenation. Generally, the reaction constant of acetylene to ethylene is two or three orders of magnitude higher than that of ethylene to ethane 47 48 49 . However, the DP-catalyzed reaction exhibits the faster reaction of double bonds to single bonds, which would seem to be an anomaly in acetylene hydrogenation.…”
Section: Resultsmentioning
confidence: 99%
“…The kinetic parameters of this reaction show some difference between phenylacetylene semihydrogenation and acetylene semihydrogenation. Generally, the reaction constant of acetylene to ethylene is two or three orders of magnitude higher than that of ethylene to ethane 47 48 49 . However, the DP-catalyzed reaction exhibits the faster reaction of double bonds to single bonds, which would seem to be an anomaly in acetylene hydrogenation.…”
Section: Resultsmentioning
confidence: 99%
“…Oxygenated groups such as hydroxyl or esteric groups exist more or less in carbonaceous derivatives such as graphene-like materials [19], and are expected to be fairly compatible with the polar part (VA part) of the EVA copolymer, Therefore, the compatibility of the graphene-like and carbon black plays a significant role in composite properties. However, the influence of fabrication method is often dominant over the chemical affinity and the dispersion of the particles in impacting the final properties of composites [20][21][22][23][24]. Hence, the effect of melt compounding after solventcasting on the electrical, thermal and mechanical properties of EVA/G composites at percolation threshold is investigated in this study.…”
Section: Introductionmentioning
confidence: 99%
“…[9,[11][12][13][14] For example, incorporating aluminum hydroxide (ATH) and silica in silicone rubber composites was found to increase the tensile strength, dielectric breakdown strength, and thermal stability of the ATH/silicone and silica/silicone rubber composites. [9,[15][16][17][18][19][20][21] The combination of micro-aluminum nitride and nano-SiO 2 fillers with silicone rubber resulted in higher thermal stability, whereas a lower dielectric permittivity was achieved. [19] Composites with microsized Si 3 N 4 and nanosized Al 2 O 3 fillers showed remarkable thermal conductivity (1.62 W m −1 K −1 ) with relatively low dielectric constant, where the nanosized filler was embedded in gaps between the microsized fillers, forming a continuous thermally conductive composite.…”
Section: Introductionmentioning
confidence: 99%