Study on the machined depth when nanoscratching on 6H-SiC using Berkovich indenter: Modelling and experimental study

Zhang, Feihu; Meng, Binbin; Geng, Yanquan; Zhang, Yong

doi:10.1016/j.apsusc.2016.02.032

Cited by 64 publications

(16 citation statements)

References 18 publications

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“…Researches have revealed that nanoscratching of hard-brittle materials is a complex process with multiple influencing factors, including scratch speed [6][7][8], shape and geometric parameters of tool [9,10], environment [11], and so on. In addition, many scholars have conducted studies to explore the effect of scratch directions in the processing of materials [12][13][14][15][16]. Yan investigated the material removal state under different scratch directions employing AFM on single crystal copper, it is found that the height of pile-up is greatly influenced by scratch directions [17].…”

Section: Introductionmentioning

confidence: 99%

“…Zhang carried out the varied-cutting-depth nanoscratching experiments on 6H-SiC using the Berkovich indenter, in which the material removal behavior during scratching was found to be affected by scratch directions. The author also found that the ductile-removal mode takes place during the nanoscratching process [16]. Only a few studies have considered the effect of scratch direction on scratching characteristics [16], but the understanding is still limited.…”

Section: Introductionmentioning

confidence: 99%

“…The author also found that the ductile-removal mode takes place during the nanoscratching process [16]. Only a few studies have considered the effect of scratch direction on scratching characteristics [16], but the understanding is still limited.…”

Section: Introductionmentioning

confidence: 99%

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Experimental and Numerical Investigation on the Effect of Scratch Direction on Material Removal and Friction Characteristic in BK7 Scratching

et al. 2020

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In order to study the influence of scratch direction on the deformation characteristics and material removal mechanism of optical glass BK7, nanoscratching experiments were conducted on a Nano indenter using Vickers indenter. Results indicate that the face-forward scratch is more likely to induce the initiation and propagation of lateral cracks, which is found to be more beneficial to material removal processes; in contrast, small chips and debris are released from the machined grooves without introducing lateral cracks in the edge-forward condition, leading to poor material removal efficiency. In addition, the choice of scratch direction can make differences to the elastic recovery rate of optical glass BK7. The results revealed that both the elastic recovery rate and the residual stresses of the material under the face-forward scratching are greater than those of the edge-forward scratching. A theoretical model for coefficient of friction (COF) under different scratch directions was established. It is found that the COF between indenter and workpiece in the edge-forward scratching is larger than the face-forward scratching under otherwise identical conditions, this finding is consistent with experimental results. A stress field analysis using finite element method (FEM) was conducted to understand the different crack initiation and propagation behaviors from different scratch directions. The current study discusses the significance of scratch direction on material removal behavior of optical glass BK7, and the results would encourage further research on investigating the connections between tool geometry and material removal mechanism.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Experimental and Numerical Investigation on the Effect of Scratch Direction on Material Removal and Friction Characteristic in BK7 Scratching

et al. 2020

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“…Zhang et al [11] performed nano-scratch tests on 6H-SiC and found the brittle-ductile transition's critical depth is around 75 nm when the applied normal load is about 12.2 mN. They also built a simulation model to reveal the relationship between the applied normal load and machined depth [12]. However, such results are mostly suitable for specific single crystal and basal plane.…”

Section: Introductionmentioning

confidence: 99%

Subsurface damages beneath fracture pits of reaction-bonded silicon carbide after ultra-precision grinding

Zhang

Luo

2018

Applied Surface Science

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This paper investigated the structural defects beneath the fracture area of 6H-SiC in reaction-bonded silicon carbide (RB-SiC) ceramics after ultra-precision grinding. The nano-indentation technique was used to evaluate the evolution of deformation behavior and find the critical transition condition among elastic, plastic and fracture. It was found that beneath the fracture pits, dislocations accompanied with micro-cracks (lateral and median) were the two types of subsurface damage. However, no amorphous phase was detected. In addition, a two-beam analysis confirmed that the dislocations were activated on basal and dissociated into the Shockley partial dislocations in 6H-SiC particle. The following indentation experiments revealed that the existence dislocations in the ground subsurface should be occurred earlier than cleavage. These dislocations were the predominant yielding mechanism in 6H-SiC, which initiated at a shear stress of about 23.4-28.4 Gpa through a pop-in event on load-displacement curve. Afterwards, cracks emerged when the maximum tensile stress beneath the indenter increased to 31.6 Gpa. It was identified that cracks could be activated under the intersection effect of non-uniform high density dislocations. Meanwhile, the blocking effect on sliding motion of dislocations caused by cross propagating dislocations, phase boundary and sintering agents play an important role in the evolution of fracture during grinding process. At last, the deformation behavior was further elaborated to discuss the slippage on the basal plane determined by Schmidt factor and structure characteristic of 6H-SiC.

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“…Silicon carbide (SiC) is a kind of nonoxide ceramic with superior properties like high thermal stability, low coefficient of thermal expansion, good wear resistance, and excellent resistance to chemical corrosion . When filled in polymer matrices, a substantial increase of the mechanical properties, wear resistance, and thermal conductivity would be achieved , leading to wide industrial applications in the electronics, chemical, mechanical, aerospace, nuclear power areas . For example, SiC particles reduce the crystallinity of linear low‐density polyethylene (LLDPE) and improved thermal stability and thermal conductivity of the resulting composites .…”

Section: Introductionmentioning

confidence: 99%

Improved mechanical and wear resistance properties of silicon carbide/poly (vinyl alcohol) composites by silane coupling agents

et al. 2017

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In this work, the surface coated silicon carbide (SiC) obtained by dispersing it in silane coupling agent/ethanol solutions of different concentrations was used as a filler in poly (vinyl alcohol)(PVA) and the composites of (PVA)/SiC were prepared by melt process. The structure and properties of PVA/SiC composites were studied by Fourier‐transform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC), scanning electron microscopy (SEM), mechanical and wear resistance tests in detail. The silane coupling agent was hydrolyzed under acidic conditions, and as a result, large number of hydroxyl and amino groups were generated, which could form hydrogen bonds with hydroxyl groups of the PVA molecular chains, this effect subsequently improved the interactions between the filler and matrix. The surface modified SiC particles dispersed well in PVA matrix resulting a good compatibility with the matrix. For the PVA/SiC composites with the same content of SiC filler, both tensile strength and elongation at break improved with the increase of silane coupling agent concentration. In addition, a good improvement in the wear resistance of the PVA/SiC composites was also achieved compared with the neat PVA/SiC composite. POLYM. COMPOS., 39:3849–3857, 2018. © 2017 Society of Plastics Engineers

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Study on the machined depth when nanoscratching on 6H-SiC using Berkovich indenter: Modelling and experimental study

Cited by 64 publications

References 18 publications

Experimental and Numerical Investigation on the Effect of Scratch Direction on Material Removal and Friction Characteristic in BK7 Scratching

Experimental and Numerical Investigation on the Effect of Scratch Direction on Material Removal and Friction Characteristic in BK7 Scratching

Subsurface damages beneath fracture pits of reaction-bonded silicon carbide after ultra-precision grinding

Improved mechanical and wear resistance properties of silicon carbide/poly (vinyl alcohol) composites by silane coupling agents

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