1998
DOI: 10.1108/13565369810233131
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Studying electro‐physical material characteristics of vacuum‐deposited layers of aluminium (tantalum) when using aluminium sheet as a carrier for MCM, interconnections, vias and resistive groups

Abstract: Investigations of material parameters within the system Al, Al2O3, Ta, Ta2O5 and TaOxN1‐x are presented. This combination is characteristic when using Al sheet for production of substrates including electronic interconnections, vias and resistive groups. They can serve for MCMs due to the specific features of Al. The technological process includes first electrochemical oxidation of Al‐sheet as base isolation layer Al2O3 (50‐70μm). This process is followed by vacuum deposition of relatively thick layers of Al (… Show more

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