Studying Pressure Induced Whiskers Formation from Sn-Rich Surfaces

Sycheva, Anna; Radanyi, A. L.; Gácsi, Zoltán

doi:10.4028/www.scientific.net/msf.790-791.271

Cited by 4 publications

(4 citation statements)

References 17 publications

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“…However, there are some examples in the literature of ambient storage studies (Diyatmika et al, 2014;Jo et al, 2013) as well. In many cases, researchers applied a direct mechanical load (Shibutani et al, 2006;Sycheva et al, 2014) or thermal cycling (Skwarek et al, 2009;Zhang et al, 2015) on their setups. The thermal cycling results in similar compression in the tin layer as the direct mechanical load because of the thermal expansion differences between the tin and the base metal.…”

Section: Introductionmentioning

confidence: 99%

Corrosion-induced tin whisker growth in electronic devices: a review

Illés

Horváth

Géczy

et al. 2017

SSMT

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Purpose The aim of this paper is to present a review of the tin whisker growth phenomena. The study focuses mainly on whisker growth in a corrosive climate when the main inducing factor of the whisker growth is oxidation. The tin whisker phenomenon is still a big challenge in lead-free reflow soldering technology. Modern lead-free alloys and surface finishes with high tin content are considered to be possible sources of whisker development, also the evolution of electronic devices towards further complexity and miniaturization points to an escalation of the reliability risks. Design/methodology/approach The present work was based on a worldwide literature review of the substantial previous works in the past decade, as well as on the results and experience of the authors in this field. Findings The effect of corrosion on tin whisker growth has been under-represented in reports of mainstream research; however, in the past five years, significant results were obtained in the field which raised the corrosion phenomena from being a side effect category into one of the main inducing factors. This paper summarizes the most important findings of this field. Practical implications This literature review provides engineers and researchers with a better understanding of the role of corrosion in tin whisker growth and the current challenges in tin whisker mitigation. Originality/value The unique challenges and future research directions about the tin whisker phenomenon were shown to highlight rarely discussed risks and problems in lead-free soldering reliability.

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Section: Introductionmentioning

confidence: 99%

Corrosion-induced tin whisker growth in electronic devices: a review

Illés

Horváth

Géczy

et al. 2017

SSMT

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“…The formation of whiskers is commonly observed in the case of tin (Sn), usually in contact with Cu [50]. The main driving force behind them is the generated mechanical stress as a result of intermetallic layer formation [51] or outer mechanical pressure [52]. The formation of the whiskers results in the relaxation of the accumulated stresses.…”

Section: Microstructural Evolution During Heattreatmentmentioning

confidence: 99%

Synthesis, characterisation and thermal behaviour of Cu-based nano-multilayer

et al. 2020

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Cu/AlN–Al2O3 nano-multilayer (NML) was deposited by magnetron sputtering method on 42CrMo4 steel samples, starting with a 15 nm AlN–Al2O3 layer and followed by 200 alternating layers of 5 nm thick Cu and 5 nm thick AlN–Al2O3 layers. The microstructure and thermal behaviour of the as-deposited and heat-treated multilayer was studied. Starting from about 400 °C, extensive coarsening of Cu nanocrystallites and the migration of Cu within the multilayer were observed via solid-state diffusion. Part of the initial Cu even formed micron-sized reservoirs within the NML. Due to increased temperature and to the different heat expansion coefficients of Cu and the AlN–Al2O3, the latter cracked and Cu appeared on the top surface of the NML at around 250 °C. Below 900 °C, the transport of Cu to the top surface of the NML probably took place as a solid-state flow, leading to faceted copper micro-crystals. However, above 900 °C, the Cu micro-crystals found on the top of the NML have rounded shape, so they were probably formed by pre-melting of nano-layered Cu due to its high specific surface area in the NML. Even if the Cu crystals appear on the top surface of the NML via solid-state flow without pre-melting, the Cu crystals on the top surface of the NML can be potentially used in joining applications at and above 250 °C.

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“…The pure tin surface is one of the most favorable ones for whiskers [4,5], but they can also grow on tin-based alloys in various conditions [5,6]; however, this phenomenon has been observed on gold, silver and aluminum surfaces too [7]. For example, whisker growth can be caused by pressure [8][9][10]. The application of tin matte coating (by large grains with C content below 0.05%) helps to reduce the risk of the formation of whiskers, also avoiding pure Sn coating, the use of porosity-free coating of Ni, or a heat treatment of the surface [3,5].…”

Section: Introductionmentioning

confidence: 99%

Whisker-Like Formations in Sn-3.0Ag-Pb Alloys

Koncz-Horváth

Gergely

Gácsi

2017

Archives of Metallurgy and Materials

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In this study, different types of whisker-like formations of Sn-3.0Ag based alloy were presented. In the experimental process the amount of Pb element was changed between 1000 and 2000 ppm, and the furnace atmosphere and cooling rate were also modified. The novelty of this work was that whisker-like formations in macro scale size were experienced after an exothermic reaction. The whiskers of larger sizes than general provided opportunities to investigate the microstructure and the concentration nearby the whiskers. In addition, the whisker-like formations from Sn-Ag based bulk material did not only consist of pure tin but tin and silver phases. The whisker-like growth appeared in several forms including hillock, spire and nodule shaped formations in accordance with parameters. It was observed that the compound phases were clustered in many cases mainly at hillocks.

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Studying Pressure Induced Whiskers Formation from Sn-Rich Surfaces

Cited by 4 publications

References 17 publications

Corrosion-induced tin whisker growth in electronic devices: a review

Corrosion-induced tin whisker growth in electronic devices: a review

Synthesis, characterisation and thermal behaviour of Cu-based nano-multilayer

Whisker-Like Formations in Sn-3.0Ag-Pb Alloys

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