2014
DOI: 10.1038/ncomms4933
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Sub-15-nm patterning of asymmetric metal electrodes and devices by adhesion lithography

Abstract: Coplanar electrodes formed from asymmetric metals separated on the nanometre length scale are essential elements of nanoscale photonic and electronic devices. Existing fabrication methods typically involve electron-beam lithography—a technique that enables high fidelity patterning but suffers from significant limitations in terms of low throughput, poor scalability to large areas and restrictive choice of substrate and electrode materials. Here, we describe a versatile method for the rapid fabrication of asymm… Show more

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Cited by 88 publications
(125 citation statements)
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“…Secondly, the coplanar asymmetric Au/Al electrodes architecture employed is rather unique and can be realized at such scale only via a-Lith. 16,17 By adopting the coplanar electrode geometry, we ensure that no electrical shorts form between the Schottky (Au) and Ohmic (Al) contacts, which as already discussed often occur during deposition of the top metal contact in conventional sandwich (staggered) diodes, while maintaining the extremely small inter-electrode (nano-gap) distance of <20 nm [ Figure 1(A)]. 17 The latter feature helps to minimize the device's series resistance and hence maintain the RC constant at ultra-low levels.…”
Section: Methodsmentioning
confidence: 99%
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“…Secondly, the coplanar asymmetric Au/Al electrodes architecture employed is rather unique and can be realized at such scale only via a-Lith. 16,17 By adopting the coplanar electrode geometry, we ensure that no electrical shorts form between the Schottky (Au) and Ohmic (Al) contacts, which as already discussed often occur during deposition of the top metal contact in conventional sandwich (staggered) diodes, while maintaining the extremely small inter-electrode (nano-gap) distance of <20 nm [ Figure 1(A)]. 17 The latter feature helps to minimize the device's series resistance and hence maintain the RC constant at ultra-low levels.…”
Section: Methodsmentioning
confidence: 99%
“…17 The resultant structures were circular gold electrodes with a circumference of roughly 1 mm separated from a host phosphonic acid self-assembled monolayer (SAM) coated Al electrode by <20 nm. The SAM was subsequently removed by subjecting the samples to 10 minutes UV-ozone treatment.…”
Section: Methodsmentioning
confidence: 99%
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“…Next‐generation flexible electronics are expected to perform under several constraints, including covering large areas at low cost, being lightweight/wearable, produced from environmentally friendly manufacturing processes, and easily integrated into other structures 4, 5. Up to now, apart from traditional photolithography, various lithographic methods, such as inkjet printing,6 atomic layer lithography,7 electrohydrodynamic lithography,8 soft lithography,9 constructive lithography,10 and adhesive lithography,11 have been explored in pursuit of a cheaper, greener, and simpler fabrication alternative. Among these methods, adhesive lithography has been shown to be very efficient and scalable; moreover, it is less sensitive to the formula of the ink and to the substrate surface treatment than are other lithographic methods 11, 12.…”
Section: Introductionmentioning
confidence: 99%
“…Up to now, apart from traditional photolithography, various lithographic methods, such as inkjet printing,6 atomic layer lithography,7 electrohydrodynamic lithography,8 soft lithography,9 constructive lithography,10 and adhesive lithography,11 have been explored in pursuit of a cheaper, greener, and simpler fabrication alternative. Among these methods, adhesive lithography has been shown to be very efficient and scalable; moreover, it is less sensitive to the formula of the ink and to the substrate surface treatment than are other lithographic methods 11, 12. Polydimethylsiloxane (PDMS) and poly(urethaneacrylate) are the most common polymers used in adhesive lithography to produce stretchable devices 12, 13.…”
Section: Introductionmentioning
confidence: 99%