“…Next‐generation flexible electronics are expected to perform under several constraints, including covering large areas at low cost, being lightweight/wearable, produced from environmentally friendly manufacturing processes, and easily integrated into other structures 4, 5. Up to now, apart from traditional photolithography, various lithographic methods, such as inkjet printing,6 atomic layer lithography,7 electrohydrodynamic lithography,8 soft lithography,9 constructive lithography,10 and adhesive lithography,11 have been explored in pursuit of a cheaper, greener, and simpler fabrication alternative. Among these methods, adhesive lithography has been shown to be very efficient and scalable; moreover, it is less sensitive to the formula of the ink and to the substrate surface treatment than are other lithographic methods 11, 12.…”