Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages

Goh, Jason Y L; Pitter, Mark C.; See, C. W.; Somekh, Michael Geoffrey; Vanderstraeten, Daniel

doi:10.1016/s0026-2714(03)00162-8

Cited by 10 publications

(2 citation statements)

References 6 publications

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“…For measurement tasks that require better accuracy, industrial cameras and sophisticated image correction (e.g. Goh et al [16]) should be seriously considered. …”

Section: Plane Strain Accuracymentioning

confidence: 99%

A simple image‐based strain measurement method for measuring the strain fields in an RC‐wall experiment

Yang

Huang

2011

Earthq Engng Struct Dyn

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SUMMARYA simple image-based method for measuring plane strain fields on the surface of specimens in earthquake engineering experiments was developed. This method integrated camera calibration, stereo triangulation, image metric rectification and image template matching techniques to develop a method that was costeffective, easy to apply and provided a satisfactory level of measurement accuracy. A zero-strain test conducted using this method showed that the measurement accuracy achieved was 0.04 pixels. That is, the relative displacement accuracy achieved was 0.005 mm and the strain accuracy was 0.001. This level of accuracy was achieved using eight-mega-pixel digital cameras to measure a 17 cm×28 cm measurement region. Cracks that were 0.012 mm wide were identified in the concrete by examining the displacement fields calculated through the application of this image-based method in an RC-wall experiment.

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“…For measurement tasks that require better accuracy, industrial cameras and sophisticated image correction (e.g. Goh et al [16]) should be seriously considered. …”

Section: Plane Strain Accuracymentioning

confidence: 99%

A simple image‐based strain measurement method for measuring the strain fields in an RC‐wall experiment

Yang

Huang

2011

Earthq Engng Struct Dyn

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“…Other applications of DIC have also been found for crack detection and stress localization evaluation in semiconductor packages [98], and damage fracture prediction [99]. The method has also been used for low cycle thermal fatigue test for solders [100] where a non-contact DIC measurement system was employed to measure the deformation of the specimen gage length instead of a contacting extensometer.…”

Section: Die Applications In Electronic Packagingmentioning

confidence: 99%

Micro-deformation characterization of electronic packaging materials and assemblies

Sun¹

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I wish to express my gratitude and appreciation to my supervisor AlP John, H.L. Pang, who has provided me not only invaluable professional knowledge in mechanics of electronic packaging, but also encouragement, support, and inspirations for exploring this research topic, as well as improving myself. I thank Dr. Shi Xunqing for bringing me to Singapore and into the area of digital image correlation for deformation measurements, where I located my research interests. His guidance made my academic dream in Nanyang Technological University (NTU) come true. I would also like to thank my former group manager Stephen, c.K. Wong in Singapore Institute of Manufacturing Technology (SIMTech) for his support when I worked in SIMTech. Many sincere thanks go to my former colleagues in SIMTech and in NTU who have provided much useful assistance during the experimental part of this research and invaluable discussion. These include Dr.

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Non-destructive evaluation of semiconductor package by electronic speckle pattern interferometry

Kim

Kang

Jung³

2005

J Mech Sci Technol

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Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages

Cited by 10 publications

References 6 publications

A simple image‐based strain measurement method for measuring the strain fields in an RC‐wall experiment

A simple image‐based strain measurement method for measuring the strain fields in an RC‐wall experiment

Micro-deformation characterization of electronic packaging materials and assemblies

Non-destructive evaluation of semiconductor package by electronic speckle pattern interferometry

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