Subgrains, Texture Evolution, and Dynamic Abnormal Grain Growth in a Mo Rod Material

Noell, Philip; Taleff, Eric M.

doi:10.1007/s11661-019-05370-2

Cited by 9 publications

(4 citation statements)

References 31 publications

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“…In this study, several cases of grain growth consuming areas of elevated dislocation density were observed; see Figure 7. Many prior studies of grain growth indicate that grains with low dislocation densities consume grains with relatively higher dislocation densities, 67–71 though the mechanism controlling such instances of grain growth remains controversial 72,73 . Regardless of mechanism, if grain growth prevents cavitation, it may improve material resilience during high‐temperature deformation.…”

Section: Discussionmentioning

confidence: 99%

“…Many prior studies of grain growth indicate that grains with low dislocation densities consume grains with relatively higher dislocation densities, [67][68][69][70][71] though the mechanism controlling such instances of grain growth remains controversial. 72,73 Regardless of mechanism, if grain growth prevents cavitation, it may improve material resilience during high-temperature deformation. While not examined in the present study, we would likewise expect dynamic recovery and recrystallization to impede void nucleation, as recently observed by the authors in high-purity aluminum during room temperature deformation.…”

Section: Void Nucleation At Hagbsmentioning

confidence: 99%

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Identifying the microstructural features associated with void nucleation during elevated‐temperature deformation of copper

Noell

Deka

Sills

et al. 2022

Fatigue Fract Eng Mat Struct

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The microstructural-scale mechanisms that produce cracks in metals during deformation at elevated temperatures are relevant to applications that involve thermal exposure. Prior studies of cavitation during high-temperature deformation, for example, creep, suffered from an inability to directly observe the microstructural evolution that occurs during deformation and leads to void nucleation. The current study takes advantage of modern high-speed electron backscatter diffraction (EBSD) detectors to observe cavitation in oxygen-free, high-conductivity copper in situ during deformation at 300 C. Most voids formed at the triple junction between a twin boundary and a high-angle grain boundary (HAGB). This finding does not contradict previous studies that suggested that twins are resistant to cracking-it reveals that cracks in HAGBs originate at twin/HAGB triple junctions and that cracks preferentially grow along HAGBs rather than the accompanying twins. Atomistic simulations explored the origins of this observation and suggest that twin/HAGB triple junctions are microstructural weak points.

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Section: Discussionmentioning

confidence: 99%

Section: Void Nucleation At Hagbsmentioning

confidence: 99%

Identifying the microstructural features associated with void nucleation during elevated‐temperature deformation of copper

Noell

Deka

Sills

et al. 2022

Fatigue Fract Eng Mat Struct

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“…Okayasu, Fukutomi and coworkers investigated dynamic grain growth in Al-Mg and Al-Cu binary solid-solution alloys [13,14] and in Fe-3 pct Si. [15] Another is recent work on dynamic abnormal grain growth in the BCC refractory metals Mo [16,[18][19][20][21][22] and Ta. [17] Investigations of superplasticity are particularly interested in dynamic grain growth because the grain boundary-sliding deformation mechanism responsible for the majority of superplastic behavior is very sensitive to grain size.…”

Section: B Dynamic Grain Growthmentioning

confidence: 99%

“…However, the literature does contain information from a number of studies concerned with dynamic normal grain growth [9][10][11][12][13][14][15] and dynamic abnormal grain growth. [16][17][18][19][20][21][22] This study investigates the nature of grain growth in an IF steel for both static and dynamic conditions.…”

Section: Introductionmentioning

confidence: 99%

Creep Deformation and Dynamic Grain Growth in an Interstitial-Free Steel

Rupp

Noell

Taleff

2020

Metall Mater Trans A

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Dynamic grain growth is demonstrated to be much faster than static grain growth in a body-centered-cubic, interstitial-free steel sheet material at 850 C. Dynamic grain growth occurs during concurrent plastic deformation at elevated temperature, whereas static grain growth occurs during static annealing. Grain growth during steady-state plastic flow in tension at 850 C to a true strain of 0.2 at a true-strain rate of 10 À4 s À1 doubled grain size, while static annealing for the same time produced no increase in grain size. This is described as dynamic normal grain growth (DNGG) because no abnormally large grains were observed. The recrystallized microstructure of the steel demonstrated a log-normal distribution of grain sizes. DNGG produced bimodal grain size distributions that deviate from the theoretical expectation of a simple shift to larger sizes during normal growth. The bimodal distributions contained a remnant of small grains that were not consumed during grain growth. DNGG produced a crystallographic texture that is unique from both the recrystallized material and that produced by lattice rotation alone. DNGG strengthened the f111gh110i and f111gh112i components of the strong c-fiber component in the original recrystallization texture. Lattice rotation from tensile deformation, by contrast, strengthened the a-fiber components that intersect the original c-fiber.

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An Investigation of the Development of Coarse Grains During β Annealing of Hot-Forged Ti-6Al-4V

Levkulich

Semiatin

Payton

et al. 2021

Metall Mater Trans A

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Subgrains, Texture Evolution, and Dynamic Abnormal Grain Growth in a Mo Rod Material

Cited by 9 publications

References 31 publications

Identifying the microstructural features associated with void nucleation during elevated‐temperature deformation of copper

Identifying the microstructural features associated with void nucleation during elevated‐temperature deformation of copper

Creep Deformation and Dynamic Grain Growth in an Interstitial-Free Steel

An Investigation of the Development of Coarse Grains During β Annealing of Hot-Forged Ti-6Al-4V

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