2009
DOI: 10.1016/j.susc.2009.01.038
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Substantially low desorption barriers in recombinative desorption of deuterium from a Si(1 0 0) surface

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Cited by 14 publications
(7 citation statements)
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“…1 is somewhat different from the above formulation of SiH 3 -induced. It is generally accepted that thermal desorption of hydrogen will occur in molecular form [12], leaving two dangling bonds at surface. (They seem to form some kind of weak bonding so that the hydrogen desorption is energetically favored.)…”
Section: Discussionmentioning
confidence: 99%
“…1 is somewhat different from the above formulation of SiH 3 -induced. It is generally accepted that thermal desorption of hydrogen will occur in molecular form [12], leaving two dangling bonds at surface. (They seem to form some kind of weak bonding so that the hydrogen desorption is energetically favored.)…”
Section: Discussionmentioning
confidence: 99%
“…It must, however, be pointed out that the schematization of the hydrogen desorption process in terms of the four reactions sketched in Figure 1 is simplistic as the overall process dynamics, in particular if a reactive gas phase is present, can in general be influenced by other surface processes, such as the diffusion of adatoms, and by the surface coverage. Some recent experimental10 and theoretical11 advances in the study of the hydrogenated surface dynamics have been published recently.…”
Section: Introductionmentioning
confidence: 99%
“…The hydrogenation of semiconductor surfaces is a topic of great interest, [1][2][3][4][5][6][7][8][9][10] The interaction of hydrogen with semiconductor surfaces generally induces important structural and electronic changes. In general, adsorption of hydrogen produces passivation of the surface; the hydrogen atoms attach to the semiconductor dangling bonds, forming strong chemical bonds ͑chemical passivation͒ and removing electronic states from the semiconductor gap ͑electronic passivation͒.…”
Section: Introductionmentioning
confidence: 99%