2005
DOI: 10.1016/j.sse.2004.11.020
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Substrate current, gate current and lifetime prediction of deep-submicron nMOS devices

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Cited by 10 publications
(15 citation statements)
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“…In ultrathin oxide, under normal operation, the effect of oxide traps will be reduced under the large tunneling current [63]. The trap-assisted or shallow trap-assisted current 9.…”
Section: Trap Capture Cross-sectionmentioning
confidence: 99%
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“…In ultrathin oxide, under normal operation, the effect of oxide traps will be reduced under the large tunneling current [63]. The trap-assisted or shallow trap-assisted current 9.…”
Section: Trap Capture Cross-sectionmentioning
confidence: 99%
“…Solid lines indicate the major current or charge transport and dash lines indicate charge transport due to oxide charge trappingdetrapping may exist but are negligible when direct tunneling occurs. From [63]. some reasons (e.g.…”
Section: Oxide Fieldmentioning
confidence: 99%
“…Hot-carrier induced device degradation has been one of the major concerns in deep submicron devices [10][11][12][13]. The degradation behaviors can be greatly suppressed by using tunneling oxide.…”
Section: Resultsmentioning
confidence: 99%
“…Process for hundred gigahertz MOS devices has been developed and some simple MOS RFICs have already appeared [7][8][9]. However, challenges still remain to resolve the important issues particularly concerning hotcarrier reliability and accurate device models for circuit designs [10][11][12]. Hot-carrier effects have been the major issues in the long-term stability of threshold voltage and channel mobility in a deep submicron MOS transistor [11][12][13].…”
Section: Introductionmentioning
confidence: 99%
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