2012
DOI: 10.1016/j.microrel.2012.06.110
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Subthreshold analog/RF performance of underlap DG FETs with asymmetric source/drain extensions

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Cited by 32 publications
(19 citation statements)
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“…However, with decrease in channel length beyond 100 nm, the short channel effects for bulk metal-oxidesemiconductor (MOS) structure increases considerably causing higher leakage current and power loss. To handle the leakage power and short channel effect, one of the possible alternatives is to use underlap double-gate MOS (DGMOS) structure [2,3]. This devices structure also offers an enhanced control over the channel current due to introduction of the additional back gate which in turn improves the circuit performance in analogue domain [4].This device configuration has also been found to offer a very large bandwidth which is crucial for RF circuit designs.…”
Section: Introductionmentioning
confidence: 99%
“…However, with decrease in channel length beyond 100 nm, the short channel effects for bulk metal-oxidesemiconductor (MOS) structure increases considerably causing higher leakage current and power loss. To handle the leakage power and short channel effect, one of the possible alternatives is to use underlap double-gate MOS (DGMOS) structure [2,3]. This devices structure also offers an enhanced control over the channel current due to introduction of the additional back gate which in turn improves the circuit performance in analogue domain [4].This device configuration has also been found to offer a very large bandwidth which is crucial for RF circuit designs.…”
Section: Introductionmentioning
confidence: 99%
“…Though, the Underlap-FinFETs show superior device performance, it suffers from a large distributed channel resistance (R ch ) which eventually degrades the on current (I on ). To overcome these limitations, various measures like the use of asymmetric source/drain extensions and applications of high κ spacer engineering have been reported [12]- [13]. In this paper, a gate engineering technique is used to improve the Underlap-FinFET device performance for low power analog/RF applications.…”
Section: Introductionmentioning
confidence: 99%
“…To minimize the SCEs, several modifications of MOSFET device have evolved. One such prominent contender is asymmetric underlap double-gate MOSFET (AUDG-MOSFET) [1]- [3]. The AUDG-MOSFET structure is specified by a drain end underlap.…”
Section: Introductionmentioning
confidence: 99%
“…The introduction of the underlap also reduces the gate-induced drain leakage and fringing capacitance. It has been established that AUDG-MOSFETs Manuscript offer a superior analog and RF performances by proper optimization of the underlap length [3]. However, AUDG-MOSFETs suffer from low ON current (I ON ) and higher distributed channel resistance compared with conventional double-gate (DG) MOSFETs (DGFETs).…”
Section: Introductionmentioning
confidence: 99%