2018 IEEE International Reliability Physics Symposium (IRPS) 2018
DOI: 10.1109/irps.2018.8353578
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Successive breakdown mode of time-dependent dielectric breakdown for Cu interconnects and lifetime enhancement under dynamic bias stress

Sol-Kyu Lee
1
,
Kyung-Uk Jang
2
,
Seol-Min Yi
3
et al.
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