2013
DOI: 10.1002/kin.20810
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Summary of Existing Models of the Ni‐P Coating Electroless Deposition Process

Abstract: Electroless nickel‐phosphorous plating is a technique often employed in preparation of protective, decorative, and functional coatings. Several feasible mechanisms are discussed in the literature. The influence of process parameters on metal coating deposition is analyzed and described. Nevertheless, some basics of the process and the fundamental aspects of plating still not explained. A number of research groups make an effort to provide a description of the process with a physical model. The aim is to design… Show more

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Cited by 12 publications
(5 citation statements)
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“…In addition to EL baths, various examples of conventional applications of EL Ni and its alloys ( e.g ., Mo, W, Re) that exploit enhanced wear resistance, hardness, corrosion resistance, and ferromagnetic properties have been described previously in this article (note, e.g ., Molybdenum and Tungsten section and Rhenium section) and in numerous reviews. ,,,,,, Likewise, examples have been described elsewhere in this article or others for EL Ni as a substrate for diffusion barriers ( e.g ., Molybdenum and Tungsten section), ,, Electroless Nickel Immersion Gold (ENIG) ( e.g ., Gold section), , Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) ( e.g ., Palladium section), ,, and EMI shielding ,, and will not be discussed here. The use of EL Ni processes for the fabrication of ultrablack films for optical applications has also been reviewed .…”
Section: Elementsmentioning
confidence: 95%
“…In addition to EL baths, various examples of conventional applications of EL Ni and its alloys ( e.g ., Mo, W, Re) that exploit enhanced wear resistance, hardness, corrosion resistance, and ferromagnetic properties have been described previously in this article (note, e.g ., Molybdenum and Tungsten section and Rhenium section) and in numerous reviews. ,,,,,, Likewise, examples have been described elsewhere in this article or others for EL Ni as a substrate for diffusion barriers ( e.g ., Molybdenum and Tungsten section), ,, Electroless Nickel Immersion Gold (ENIG) ( e.g ., Gold section), , Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) ( e.g ., Palladium section), ,, and EMI shielding ,, and will not be discussed here. The use of EL Ni processes for the fabrication of ultrablack films for optical applications has also been reviewed .…”
Section: Elementsmentioning
confidence: 95%
“…This mechanism considered that Ni plating is resulted from anodic and cathodic reactions. The anodic reaction is the oxidation of hypophosphite with water, which generates electrons needed for cathodic reactions according to the equation 1 [4,5,[21][22][23]:…”
Section: Effect Of Bath Composition On the Deposition Rate (Dr)mentioning
confidence: 99%
“…It is well known that, for Ni deposition, the H + are generated according to the atomic hydrogen mechanism. The atomic hydrogen is produced from hypophosphite reduction with water, and is then desorbed at the catalytic surface according to the equations below [23]:…”
Section: Effect Of Bath Composition On the Buffering Capacity (δPh/g)mentioning
confidence: 99%
“…Hipofosfitoak (H2PO2 -) metala erreduzitzean fosfitoa (HPO3 2-) sortzen du oxidazio-produktu gisa (Stankiewicz et al, 2013). Ondorioz, erreduktorearen kontzentrazioa gutxitzen joaten da estaldurak egiten direnean, eta hipofosfitoaren kontzentrazioa estaldura bakoitzaren ondoren doitu behar da.…”
Section: Sarrera Eta Motibazioaunclassified