“…All the different types of deposition techniques of buffer and superconductor such as: pulse laser deposition, PLD [6]; ion-beam assisted-deposition, IBAD, [6,7]; sputtering [8], chemical vapour deposition, CVD [9]; metal organic deposition, MOD, [10,11]; metal organic chemical vapour deposition, MOCVD [12]; thermal evaporation [13]; sol-gel deposition [14,15]; ink-jet printing and coating [16]; dip coating [17]; and liquid phase processing [18,19], Tab.1, have been used to manufacture shorter or longer pieces of the high temperature superconducting tapes on a laboratory scale [20,21]. There is an additional aspect to the multifilamentary conductor preparation, which is needed for AC applications [22]. The outline of the two main conductor architectures for DC and AC applications are presented in Fig.4 and the aspects concerning computer design and processing will be discussed in later paragraphs.…”