2001
DOI: 10.1016/s0011-2275(01)00053-4
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Superconducting-magnetic heterostructures as a new method of decreasing transport AC losses in multifilamentary and coated superconductors

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Cited by 22 publications
(21 citation statements)
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“…A way to reduce the hysteresis loss in such tapes by dividing them into a large number of parallel stripes segregated by non-superconducting resistive barriers was proposed in Refs. [17,18]. An experiment on small samples of YBCO films deposited on LaAlO3 substrate has confirmed the validity of that suggestion [19].…”
Section: Introductionsupporting
confidence: 55%
“…A way to reduce the hysteresis loss in such tapes by dividing them into a large number of parallel stripes segregated by non-superconducting resistive barriers was proposed in Refs. [17,18]. An experiment on small samples of YBCO films deposited on LaAlO3 substrate has confirmed the validity of that suggestion [19].…”
Section: Introductionsupporting
confidence: 55%
“…9. The copper sheathed wire prepared by an in-situ process [27] has rather small values. This can be explained by the ductility of copper, which does not allow for an efficient compression of the superconductor or its precursor powders, leading to a poor density of MgB 2 , thus enhancing p c .…”
Section: Changes Of the Reversible Propertiesmentioning
confidence: 99%
“…All the different types of deposition techniques of buffer and superconductor such as: pulse laser deposition, PLD [6]; ion-beam assisted-deposition, IBAD, [6,7]; sputtering [8], chemical vapour deposition, CVD [9]; metal organic deposition, MOD, [10,11]; metal organic chemical vapour deposition, MOCVD [12]; thermal evaporation [13]; sol-gel deposition [14,15]; ink-jet printing and coating [16]; dip coating [17]; and liquid phase processing [18,19], Tab.1, have been used to manufacture shorter or longer pieces of the high temperature superconducting tapes on a laboratory scale [20,21]. There is an additional aspect to the multifilamentary conductor preparation, which is needed for AC applications [22]. The outline of the two main conductor architectures for DC and AC applications are presented in Fig.4 and the aspects concerning computer design and processing will be discussed in later paragraphs.…”
Section: Materials Design and Processes Considerationsmentioning
confidence: 99%
“…Such Ni-O layers are successfully used in LPE processing [18,19]. In the second generation AC conductors for small magnetic field ~ 0.4T, where interfilamentary decoupling is vital, magnetic buffer layer will be introduced [22,40,41]. There is a need for smoothness of the buffer layer to avoid the a-axis growth of YBa 2 Cu 3 O 7 .…”
Section: Buffer Layermentioning
confidence: 99%
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