With
the development of flexible electronics, researchers have
endeavored to improve the characteristics of the commonly used indium
tin oxide such as brittleness, poor mechanical or chemical stability,
and scarcity. Currently, many alternative materials have been considered
such as conductive polymers, graphene, carbon nanotubes, metallic
nanoparticles (NPs), nanowires (NWs), or nanofibers. Among them, silver
(Ag) mesh/grid NPs or NWs have been considered as an excellent substitute
due to the good transmittance, excellent electrical conductivity,
outstanding mechanical robustness, and cost competitiveness. So far,
much effort has been devoted to the fabrication of Ag mesh/grid, and
many methods such as printing technology, self-assembly, electrospun,
hot-pressing, and atomic layer deposition have been reported. Here
printing technologies include jet printing, gravure printing, screen
printing, nanoimprint lithography, microcontact printing, and flexographic
printing. The solution-based self-assembly usually combines with coating,
template, or mask assistance. This review summarizes the characteristics
of these fabrication methods for the Ag mesh/grid with its related
applications in electronics. Then the prospect and challenges of the
fabrication methods are discussed, and the new preparation approaches
and applications of the Ag mesh/grid are highlighted, which will be
of significance for the applications in electronics such as transparent
conducting electrodes, organic light-emitting diode, energy harvester,
strain sensor, cells, etc.