Surface and subsurface damage of reaction-bonded silicon carbide induced by electrical discharge diamond grinding

Abstract

Reaction-bonded silicon carbide (RB-SiC) ceramic, one of the best candidates for large optical mirrors, is difficult to machine because of its high hardness and brittleness. A hybrid process called electrical discharge diamond grinding (EDDG) exhibits potential for improving the machinability of RB-SiC by combining electrical discharge machining (EDM) and diamond grinding. However, this hybrid process leads to damages that differ from those in conventional processes owing to the simultaneous actions of EDM and diamond grinding. In the present study, surface and subsurface damages induced by the interactions between EDM and diamond grinding during the EDDG of RB-SiC were examined. The effect of the discharge energy was considered.The surface and subsurface topographies and microstructures were characterized via scanning electron microscopy, Raman spectroscopy, and transmission electron microscopy. The EDM and grinding zones exhibited distinctive surface topographies and different dominant material removal mechanisms. An increase in the discharge energy facilitated ductile removal of the material and decomposition of SiC. Thus, a thinner subsurface damage layer was obtained compared with that in the less-thermally affected zone. The decomposed C and material migration tended to increase with the discharge energy. Owing to the interactions between EDM and diamond grinding, the subsurface was a mixture of amorphous/crystalline C, polycrystalline/nanocrystalline

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“…Furthermore, the diffraction pattern (Fig. 11(c)) corresponding to the area is indicative of a single crystal structure [41]. Thus, these results indicate the pristine sample material is a singe crystal without defects before machining.…”

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“…In the next stage, an increase in chip thickness causes increased plastic deformation, inducing microcracks [ 52 ]. The relative motion of the grain produces tangential forces and shear stresses [ 53 ]. When a certain penetration depth is reached in the last stage, lateral cracks and chips of a certain depth are formed.…”

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“…Advanced industrial systems require increasingly improved product performance along with an increased need for quality control during production [1][2][3]. However, defects, such as scratches, spots, or holes on the surface of the product, adversely affect not only the aesthetics of the product and the comfort in using it but also its performance [4][5][6][7]. Defect detection is an effective method to reduce the adverse impact of product defects [8,9].…”