2008 IEEE 35th International Conference on Plasma Science 2008
DOI: 10.1109/plasma.2008.4590724
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Surface barrier discharge assisted deposition of water repellent films from N<inf>2</inf>/HMDSO mixtures on surface of poplar veneer

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Cited by 3 publications
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“…The quantity of deposited material by PECVD is orders of magnitude smaller, making the process more cost-efficient and the product recyclable [ 3 ]. With the recent advantages in plasma techniques, both low-pressure [ 4 , 7 ] and atmospheric pressure [ 2 , 3 , 25 ] plasma can be successfully employed. The initial investment in PECVD systems in case of low-pressure plasma might be high, while the operating costs are low, and any high-volume industry should on the long run profit using these systems.…”
Section: Introductionmentioning
confidence: 99%
“…The quantity of deposited material by PECVD is orders of magnitude smaller, making the process more cost-efficient and the product recyclable [ 3 ]. With the recent advantages in plasma techniques, both low-pressure [ 4 , 7 ] and atmospheric pressure [ 2 , 3 , 25 ] plasma can be successfully employed. The initial investment in PECVD systems in case of low-pressure plasma might be high, while the operating costs are low, and any high-volume industry should on the long run profit using these systems.…”
Section: Introductionmentioning
confidence: 99%
“…This plasma set-up does not require vacuum conditions, is more effective because of the higher pressure and is well suited for the creation and deposition of thin hydrophobic layers on wood surfaces (Mahlberg et al, 1998;Denes et al, 1999;Bente et al, 2004;Odrásková et al, 2007Odrásková et al, , 2008b. In contrast to Denes et al (1999) and Mahlberg et al (1998), who conducted plasma treatment at low pressure, and Odrásková et al, (2007Odrásková et al, ( , 2008b, who used a diffuse coplanar surface barrier discharge, which requires a small discharge gap of 0.3 mm, in the present study a plasma jet was used to create a HMDSO-containing plasma at atmospheric pressure. This set-up combines the advantages of atmospheric pressure and a certain degree of independence from the surface profile, substrate material and thickness, and is therefore well suited for the deposition of thin surface layers on wood.…”
Section: Introductionmentioning
confidence: 99%