Surface characterisation of carbon films produced by plasma chemical vapour deposition method

Abstract

Carbon films were deposited on Si (111) wafers by microwave electron cyclotron resonance/ plasma assisted chemical vapour deposition using a benzene-argon gas mixture with different argon flowrates (5, 15 and 30 sccm). The structure, surface morphology and hardness were studied. The film surface has been characterised by Raman spectroscopy to study the hybridisation of carbon in the film, and Fourier transform infrared spectroscopy was conducted to obtain bonding characteristics. The morphology of the films has been inspected by atomic force microscopy.

Study of protective diamond-like carbon films on GCr15 bearing steel

“…The FTIR curves show that the peak at around 2920 cm −1 is of anti-symmetric stretching vibrations of sp 3 bonded CH 2 group, and the peak at 2850 cm −1 is of symmetric stretching vibrations of sp 3 bonded CH 2 group or CH 3 group. The peaks are consistent with the results obtained by Khettache et al 19 At the same time, the peaks around 1450, 1136 and 1032 cm −1 also are sp 3 –C–H (2,3) modes.…”

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

“…Several deposition techniques are used to deposit thin (<1 μm) and thick (>1 μm) copper films. Physicalvapour-deposition (PVD) processes [17][18][19][20], like sputtering [21][22][23][24][25] and electron beam evaporation [26][27][28][29], Chemical-vapour-deposition (CVD) [30][31][32][33][34], atomic layer deposition (ALD) [35][36][37][38] methods are used to deposit high-quality, defect-free, continuous films; however, the average thickness of deposited films is generally less than 1 μm. Electroplating is used in those applications where the thick blanket film is required or blind/through holes must be filled.…”