Surface characteristics of aluminum 6061-T6 subjected to Nd:YAG pulsed-laser irradiation

Choi, Sungho; Kim, Chung Seok; Jhang, Kyung-Young; Shin, Wan Soon

doi:10.1007/s12206-012-0537-x

Cited by 17 publications

(4 citation statements)

References 10 publications

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“…Multiple reflections and absorptions of the laser beam at the crack increased the absorption, causing melting to occur first along the crack. 23 Figure 3(c) shows the OM image of the "A" zone in Fig. 3(a), which is the boundary of the melted area.…”

Section: Methodsmentioning

confidence: 99%

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Thermal damages on the surface of a silicon wafer induced by a near-infrared laser

Choi

Jhang²

2014

Opt. Eng

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Abstract. Laser-induced thermal damages of a silicon wafer surface subjected to continuous near-infrared laser irradiation were investigated. Silicon wafer specimens were illuminated by a continuous-wave fiber laser beam (1070-nm wavelength) with irradiances from 93 to 186 W∕cm 2 , and the surface morphology of each specimen was analyzed using optical microscopy. With increasing irradiance, straight cracks in the <110> direction appeared first, and partial melting and complete melting were subsequently observed. The mechanism of these laser-induced thermal damages in the silicon wafer surface was discussed with numerical analysis based on the heat transfer and thermoelasticity model. The irradiances initiating the cracking and melting were predicted by determining the irradiances in which the calculated thermal stress and temperature exceeded the corresponding limits of the fracture strength and melting point, respectively. These predictions agreed well with the experimental findings. Laser-induced thermal damages of the silicon wafer surface subjected to a continuous near-infrared laser irradiation were identified based on these investigations. © The Authors. Published by SPIE under a Creative Commons Attribution 3.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

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Section: Methodsmentioning

confidence: 99%

“…23 In the simulation model, the absorption of the laser beam was supposed to occur only once. But if surface cracks appeared during the laser beam irradiation, the absorbance of the laser energy is increased by multiple reflections and absorptions.…”

Section: Optical Engineeringmentioning

confidence: 99%

Thermal damages on the surface of a silicon wafer induced by a near-infrared laser

Choi

Jhang²

2014

Opt. Eng

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“…It is significantly important to heal the damage before fatigue failure for the engineering application. In the field of material strength, some methods for healing damage of materials have been investigated by some researchers, including conventional heat treatment (Du et al, 2004;Wagner et al, 2008), surface removal (Sharp et al, 2002), high-density electric current pulses (Qiao et al, 2009;Zhou et al, 2004), plasma nitriding (Alsaran et al, 2004), laser surface treatment (Choi1 et al, 2012;Ren et al, 2014;Shang et al, 2013), self-healing repairing for composite materials (White et al, 2001), and so on. These methods can effectively improve the fatigue property of materials.…”

Section: Introductionmentioning

confidence: 99%

Life prediction method of copper thin film repaired by laser irradiation based on healing variable

Ren

Shang

2016

International Journal of Damage Mechanics

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The cyclic stress–strain constitutive relationships for copper film smooth specimens with different damage degrees before and after laser irradiation treatment were investigated. Compared with the changes of the constitutive relationships under different damage degrees, a healing variable for the repaired copper film by laser irradiation was defined. Based on the analysis of the healing variable, a fatigue life prediction method was proposed. The experimental lives of the damaged notched specimens after laser irradiation treatment were used to verify the proposed life prediction method. The results showed that the predicted lives are in good agreement with the experimental results.

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“…Due to this thermal effect, laserinduced surface damage, such as slipping, cracking, melting, and ablation, occur. [6][7][8] Previous investigations of laser-induced damage by laser weapons have focused primarily on rockets, mortars, missiles, and aircraft made of metallic materials. These are all potential targets of laser weapons.…”

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confidence: 99%

Initiation time of near-infrared laser-induced slip on the surface of silicon wafers

Choi

Jhang

2014

Applied Physics Letters

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We have determined the initiation time of laser-induced slip on a silicon wafer surface subjected to a near-infrared continuous-wave laser by numerical simulations and experiments. First, numerical analysis was performed based on the heat transfer and thermoelasticity model to calculate the resolved shear stress and the temperature-dependent yield stress. Slip initiation time was predicted by finding the time at which the resolved shear stress reached the yield stress. Experimentally, the slip initiation time was measured by using a laser scattering technique that collects scattered light from the silicon wafer surface and detects strong scattering when the surface slip is initiated. The surface morphology of the silicon wafer surface after laser irradiation was also observed using an optical microscope to confirm the occurrence of slip. The measured slip initiation times agreed well with the numerical predictions.

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Surface characteristics of aluminum 6061-T6 subjected to Nd:YAG pulsed-laser irradiation

Cited by 17 publications

References 10 publications

Thermal damages on the surface of a silicon wafer induced by a near-infrared laser

Thermal damages on the surface of a silicon wafer induced by a near-infrared laser

Life prediction method of copper thin film repaired by laser irradiation based on healing variable

Initiation time of near-infrared laser-induced slip on the surface of silicon wafers

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