Surface charging suppression using PEDOT/PSS in the fabrication of three dimensional structures on a quartz substrate

Mohamed, Khairudin; Alkaisi, Maan M.; Blaikie, Richard J.

doi:10.1016/j.mee.2008.11.075

Cited by 19 publications

(13 citation statements)

References 7 publications

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“…This chapter presents a number of approaches attempted for grounding the trapped charges for suppressing the surface charging effects during the pattern definition on quartz substrate. This also applies in fabricating three-dimensional nanostructures on insulating substrates [8]. The deposition of thin metallic layer on top of imaging resist layer is a common practise but requires wet etching process using acidic solution to remove the metallic layer in post e-beam exposure process.…”

Section: The Fabrication Methodsmentioning

confidence: 99%

The Fabrication of High Aspect Ratio Nanostructures on Quartz Substrate

Mohamed¹,

Alkaisi²

2013

Updates in Advanced Lithography

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Section: The Fabrication Methodsmentioning

confidence: 99%

The Fabrication of High Aspect Ratio Nanostructures on Quartz Substrate

Mohamed¹,

Alkaisi²

2013

Updates in Advanced Lithography

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“…2 Metal coatings deposited on top of PMMA resist are usually used to overcome the charge accumulation problem. 7 The described approaches have demonstrated reasonable outcomes and are considered to be promising methodologies for fabrication of nanoscale UV masters. 3 However, scattering of electrons in the metal layer limits the applicability of this technique at the deep nanoscale.…”

Section: Introductionmentioning

confidence: 93%

Nanopatterning of PMMA on insulating surfaces with various anticharging schemes using 30 keV electron beam lithography

Muhammad¹,

Buswell²,

Dew³

et al. 2011

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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Interference lithography for metal nanopattern fabrication assisted by surface plasmon polaritons reflecting image Long nanoscale gaps on III-V substrates by electron beam lithography J. Vac. Sci. Technol. B 30, 06F305 (2012); 10.1116/1.4766881Fabrication of ultra-high-density nanodot array patterns (3 Tbits/in.2) using electron-beam lithography As a low cost and high throughput method for nanoscale pattern replication, step and flash imprint lithography (SFIL) with UV transparent masters is gaining prominence for its potential in photonics and integrated-circuit fabrication. However, dielectric materials appropriate for fabricating nanostructured SFIL masters present a challenge when employing electron beam lithography (EBL) because insulator substrates covered by polymeric resists such as PMMA tend to accumulate charge during EBL exposures, thereby degrading the process. In this work we explore the performance of four different EBL anticharging schemes for nanofabrication of dense arrays of dots having diameters 16-30 nm in PMMA on UV transparent fused silica (FS) substrates. These include overlayers of aluminum or a water-soluble conducting polymer, as well as sandwiching of Al or Cr thin films between the substrate and PMMA. The quality of patterns transferred from PMMA into the underlying metallic layers was analyzed, and the grain size of the metal was found to be the limiting factor determining the edge roughness. The best resolution was attained employing the conducting polymer top-coating. This scheme also involves fewer processing steps. The authors have used this technique for lift-off of Cr and Au as well as Cr masked etch transfer of nanosized patterns into glass substrates for UV-transparent master mold fabrication.

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“…In contrast to conducting substrates, when exposing insulating substrates with an electron beam, the charge can become trapped near the surface, is unable to dissipate, resulting in charge build up and subsequently deflecting additional incoming electrons. This results in distorted patterns and loss in resolution [11,21,25]. A conductive layer, either above / below the resist, is commonly used in conjunction with patterning on insulating substrates -illustrated in Figure 1.…”

Section: Considerations For Ebl On Insulating Substratesmentioning

confidence: 99%

“…Nanofabrication on insulating substrates using high energy EBL can be challenging due to several key factors. These include increased electron back scattering; insufficient charge dissipation; large area dose required for exposing conventional high resolution e-beam resists (such as poly(methyl methacrylate) (PMMA) / hydrogen silsesquioxane (HSQ) / ZEP-series) at high EBL acceleration voltages; and inevitably a large beam current in order to pattern with acceptable throughput [7][8][9][10][11][12][13][14][15][16]. Workarounds include depositing an ultra-thin metallic layer either above or below the resist or using a conductive polymer; both methods are used to dissipate the built-up charge during exposure [10,[17][18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of nanostructured transmissive optical devices on ITO-glass with UV1116 photoresist using high-energy electron beam lithography

Williams

Bartholomew²,

Rughoobur³

et al. 2016

Nanotechnology

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High-energy electron beam lithography for patterning nanostructures on insulating substrates can be challenging. For high resolution, conventional resists require large exposure doses and for reasonable throughput, using typical beam currents leads to charge dissipation problems. Here, we use UV1116 photoresist (Dow Chemical Company), designed for photolithographic technologies, with a relatively low area dose at a standard operating current (80 kV, 40-50 μC cm, 1 nAs) to pattern over large areas on commercially coated ITO-glass cover slips. The minimum linewidth fabricated was ∼33 nm with 80 nm spacing; for isolated structures, ∼45 nm structural width with 50 nm separation. Due to the low beam dose, and nA current, throughput is high. This work highlights the use of UV1116 photoresist as an alternative to conventional e-beam resists on insulating substrates. To evaluate suitability, we fabricate a range of transmissive optical devices, that could find application for customized wire-grid polarisers and spectral filters for imaging, which operate based on the excitation of surface plasmon polaritons in nanosized geometries, with arrays encompassing areas ∼0.25 cm.

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Surface charging suppression using PEDOT/PSS in the fabrication of three dimensional structures on a quartz substrate

Cited by 19 publications

References 7 publications

The Fabrication of High Aspect Ratio Nanostructures on Quartz Substrate

The Fabrication of High Aspect Ratio Nanostructures on Quartz Substrate

Nanopatterning of PMMA on insulating surfaces with various anticharging schemes using 30 keV electron beam lithography

Fabrication of nanostructured transmissive optical devices on ITO-glass with UV1116 photoresist using high-energy electron beam lithography

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