2017
DOI: 10.1016/j.apsusc.2017.05.015
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Surface chemical structure and doping characteristics of boron-doped Si nanowires fabricated by plasma doping

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Cited by 11 publications
(11 citation statements)
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“…The plasma doping process was used for Si NSs doping. This plasma doping process has some advantages to nanomaterials such as lower surface damage and higher dose rate compared with ion implantation. , In this regard, the plasma doping process is widely employed for nanowires and Fin field effect transistors (FETs) technology . PH 3 and BF 3 plasma were used for n - and p -type doping, respectively, of the Si NSs.…”
Section: Experimental Detailsmentioning
confidence: 99%
“…The plasma doping process was used for Si NSs doping. This plasma doping process has some advantages to nanomaterials such as lower surface damage and higher dose rate compared with ion implantation. , In this regard, the plasma doping process is widely employed for nanowires and Fin field effect transistors (FETs) technology . PH 3 and BF 3 plasma were used for n - and p -type doping, respectively, of the Si NSs.…”
Section: Experimental Detailsmentioning
confidence: 99%
“…These localized surface plasmon resonance (LSPR) changes are consistent with the increase in doping, correlating with the decrease in the oxide. This observation can be due to the high-temperature ionization process (2 MHz) ionizing the metal species, supporting the diffusion of B into Si and thereby allowing the substitution of B into the Si lattice, generating holes …”
Section: Resultsmentioning
confidence: 93%
“…For the sensor produced at a high ionization rate (HDMS), the Si 2p spectra show deconvolution peaks at 97.78, 102.7, and 103.2 eV (Figure d). These peaks are attributed to the Si–Si bond, the Si–B bond, and SiO 2 , respectively. , The Si–B peak not observed in the bulk substrate (Figure d) clearly illustrates that B reacts with Si in the HDMS; in other words, it is an indication of substitution of Si atoms with B . When decreasing the ionization rate, the deconvolution peak corresponding to Si–Si increases and Si–B decreases or disappears further in the MDMS and PDMS, respectively (Figure S2a).…”
Section: Resultsmentioning
confidence: 96%
“…The CAS-CI and SE calculation are performed with a cc-pVTZ basis set for both the systems. The ground state electronic configuration of the BF is given as, 1a 2 1 , 2a 4 , 5σ 2 in C ∞v symmetry), while the electronic ground state configuration of BF 2 in its equilibrium geometry is given as 1b…”
Section: The R-matrix Methodsmentioning
confidence: 99%
“…However, to the best of our knowledge there has been little experimental or theoretical investigation on electron scattering from these radicals. BF 3 plasmas generated from arc, pulsed or RF/ECR discharge are used as a boron source, which in turn is widely used as a p-type dopant in the ion implantation for the semiconductor industry [1][2][3]. The halogen-containing gaseous BF 3 is important for a variety of plasma technologies and finds applications in the field of material processing, plasma-assisted fabrication of large integrated circuits and semiconductor fabrication [4].…”
Section: Introductionmentioning
confidence: 99%