2013
DOI: 10.1016/j.jnucmat.2012.08.019
|View full text |Cite
|
Sign up to set email alerts
|

Surface cracking on Σ3, Σ9 CSL and random grain boundaries in helium implanted 316L austenitic stainless steel

Abstract: The relationship between surface cracking at grain boundaries and the grain boundary nature in helium implanted 316L austenitic stainless steel was investigated by in-situ annealing in a high-voltage electron microscope, and by SEM and TEM observations. The nucleation and growth of helium bubbles at a random grain boundary was observed during annealing up to 973 K. After annealing, surface cracking was observed at the random grain boundaries and some coincidence site lattice (CSL) boundaries because of the for… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

1
15
0

Year Published

2017
2017
2021
2021

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 32 publications
(16 citation statements)
references
References 31 publications
1
15
0
Order By: Relevance
“…From TEM and SEM images, the cracks have already actually initiated while the recrystallization process has not be completely done, for example in the irradiated SiC annealed for 2 h at 900 °C. According to other relevant studies [ 22 , 23 , 24 ] and our current research results, the crack propagation should be caused by the tensile stress produced by the annealing-induced recrystallization. A probabilistic crack model with a power law was defined and developed by P. Rajeev and Tesfamariam [ 32 ] as shown in the equation where C W is the crack width; ∆ T is a temperature difference between the initial temperature and annealing temperature; a and b are fitting coefficients according to the experiment data.…”
Section: Resultssupporting
confidence: 61%
See 1 more Smart Citation
“…From TEM and SEM images, the cracks have already actually initiated while the recrystallization process has not be completely done, for example in the irradiated SiC annealed for 2 h at 900 °C. According to other relevant studies [ 22 , 23 , 24 ] and our current research results, the crack propagation should be caused by the tensile stress produced by the annealing-induced recrystallization. A probabilistic crack model with a power law was defined and developed by P. Rajeev and Tesfamariam [ 32 ] as shown in the equation where C W is the crack width; ∆ T is a temperature difference between the initial temperature and annealing temperature; a and b are fitting coefficients according to the experiment data.…”
Section: Resultssupporting
confidence: 61%
“…Surface cracking is one of these features, which has a significant influence on the properties of SiC [ 21 ]. In fact, surface cracks can be generated on the surface of lots of ion-irradiated solid materials after annealing process [ 22 , 23 , 24 ]. The main reason for the formation of surface cracks should be attributed to the internal excessive stress including thermal stress [ 24 , 25 ], fatigue stress [ 26 , 27 ], and tensile stress [ 28 , 29 ].…”
Section: Introductionmentioning
confidence: 99%
“…Sakaguchi et al studied that CSL boundaries exhibited high resistance to the crack propagation, and illustrated a relationship between the boundary structures and grain boundary energies that were directly connected to the coincidence site lattice model. Owing to simpler and smaller structural units, the low‐∑CSL boundaries featured as low excess grain boundary energy and strong bonding force have the attribute of reaction to the cleavage crack propagating along grain boundaries, as well as control intergranular brittleness and change intergranular fracture into transgranular fracture.…”
Section: Discussionmentioning
confidence: 99%
“…Many experiments have been carried out in order to improve the helium resistance ability of materials [3] [4] [5]. Fabritsiev et al [3] studied the effect of the grain size and high rate of helium accumulation on radiation resistance of pure copper for fusion equipment applications.…”
Section: Introductionmentioning
confidence: 99%