Surface damage of soda–lime–silica glasses: indentation scratch behavior

Houérou, Vincent Le; Sangleboeuf, Jean‐Christophe; Deriano, S.; Rouxel, Tanguy; Duisit, Géraldine

doi:10.1016/s0022-3093(02)01937-3

Cited by 135 publications

(92 citation statements)

References 22 publications

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“…These phenomena, summarised in Figure 1, range from the nucleation and propagation of individual dislocations, to the formation of dislocation bands, as well as the generation of new amorphous or crystalline phases. Figure 1 is based on a recent work on scratching of glasses by Le HouØrou et al [5] Eventually, the creation of atomically sharp cracks below the scratch is observed when scratching at higher load using a sharp diamond tip. Such cracks might extend in the substrate beyond the plastically deformed area.…”

Section: Semiconductor Nano-scratchingmentioning

confidence: 99%

Cleavage Fracture of Brittle Semiconductors from the Nanometre to the Centimetre Scale

et al. 2005

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The objective of this paper is to present the fundamental phenomena occurring during the scribing and subsequent fracturing process usually performed when preparing surfaces of brittle semiconductors. In the first part, an overview of nano‐scratching experiments of different semiconductor surfaces (InP, Si and GaAs) is given. It is shown how phase transformation can occur in Si under a diamond tip, how single dislocations can be induced in InP wafers and how higher scratching load of GaAs wafer leads to the apparition of a crack network below the surface. A nano‐scratching device, inside a scanning electron microscope (SEM), has been used to observe how spalling (crack and detachment of chips) and/or ductile formation of chips may happen at the semiconductor surface. In the second part cleavage experiments are described. The breaking load of thin GaAs (100) wafers is directly related to the presence of initial sharp cracks induced by scratching. By performing finite element modelling (FEM) of samples under specific loading conditions, it is found that the depth of the median crack below the scratch determines quantitatively the onset of crack propagation. By carefully controlling the position and measuring the force during the cleavage, it is demonstrated that crack propagation through a wafer can be controlled. Besides, the influence of the loading configuration on crack propagation and on the cleaved surface quality is explained.

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Section: Semiconductor Nano-scratchingmentioning

confidence: 99%

Cleavage Fracture of Brittle Semiconductors from the Nanometre to the Centimetre Scale

et al. 2005

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“…Furthermore, certain properties of this type of glass such as the Young's and shear moduli and the density show an anomalous dependence on the fictive temperature. When indented with a Vickers tip, silica glass exhibits a cracking pattern that is more complex than in a typical normal glass, such as soda-lime silicate [3,4]. Specifically, silica glass has a strong tendency to form ring cracks at the periphery of the indenter impression, but other crack systems typical of normal glasses, i.e.…”

Section: Introductionmentioning

confidence: 99%

Simulation of Vickers indentation of silica glass

Jebahi

Debenath

Dau

et al. 2013

Journal of Non-Crystalline Solids

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is an open access repository that collects the work of Arts et Métiers ParisTech researchers and makes it freely available over the web where possible. AbstractThe indentation response of glasses can be classified under three headings: normal, anomalous and intermediate, depending on the deformation mechanism and the cracking response. Silica glass, as a typical anomalous glass, deforms primarily by densification and has a strong tendency to form cone cracks that can accompany median, radial and lateral cracks when indented with a Vickers tip. This is due to its propensity to deform elastically by resisting plastic flow. Several investigations of this anomalous behavior can be found in the literature. The present paper serves to corroborate these results numerically using the discrete element method. A new pressuredensification model is developed in this work that allows for a quantitative estimate of the densification under very high pressure. This model is applied to simulate the Vickers indentation response of silica glass under various indentation forces using the discrete element method first, and then a discrete-continuum coupling method with large simulation domains to suppress the side effects and reduce the computational time. This coupling involves the discrete element method (DEM) and the constrained natural element method (CNEM). The numerical results obtained in this work compare favorably with past experimental results.

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“…Scratch resistance is an important property in many applications. [31][32][33] In the present work, the effect of GNP concentration on the scratch resistance of alumina was investigated by fabricating alumina-GNP (0.5, 2 and 5 vol.-%) composites using spark plasma sintering. The fabricated composites were tested using single pass scratch testing.…”

Section: Introductionmentioning

confidence: 99%

Scratch behaviour of graphene alumina nanocomposites

Porwal

Kašiarová

Tatarko

et al. 2015

Advances in Applied Ceramics

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The scratch resistance behaviour of alumina-graphene nanoplatelet (GNP) (0.5, 2 and 5 vol.-%) composites was investigated using a Rockwell indenter with normal applied loads ranging from 1 to 200 N. The alumina-GNP composites behaved differently during scratch testing depending on the normal applied load. The coefficient of friction of the composites did not change much at low normal loads but increased with increasing amount of GNP in the alumina matrix for high normal loads. The addition of GNP contributed to improved scratch resistance of alumina nanocomposites only for low loads below ,97 N. This correlates with the mechanical properties of the composites. As the applied load increased, the scratch resistance of the GNP composites decreased due to the presence of weakly bonded grain boundaries in the alumina matrix, which enhanced chipping of material.

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Surface damage of soda–lime–silica glasses: indentation scratch behavior

Cited by 135 publications

References 22 publications

Cleavage Fracture of Brittle Semiconductors from the Nanometre to the Centimetre Scale

Cleavage Fracture of Brittle Semiconductors from the Nanometre to the Centimetre Scale

Simulation of Vickers indentation of silica glass

Scratch behaviour of graphene alumina nanocomposites

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