1990
DOI: 10.1016/0022-0248(90)90225-a
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Surface defects in GaAs wafer processes

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Cited by 5 publications
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“…They also found that the orange peel is concentrated on large spatial resolution 350 μm and low amplitude peak-valley height (60 nm peak to valley value). The irregular surface texture, "orange peel" is related to the chemistry and mechanics of the polishing process [12]. These results confirm the relevancy of the multi-scale analysis.…”
Section: Conventional Calculationsupporting
confidence: 74%
“…They also found that the orange peel is concentrated on large spatial resolution 350 μm and low amplitude peak-valley height (60 nm peak to valley value). The irregular surface texture, "orange peel" is related to the chemistry and mechanics of the polishing process [12]. These results confirm the relevancy of the multi-scale analysis.…”
Section: Conventional Calculationsupporting
confidence: 74%