1992
DOI: 10.1557/proc-259-237
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Surface Electronic States of Low Temperature H-plasma Cleaned Si(100) and Ge(100) Surfaces

Abstract: The surfaces of Si(100) and Ge(100), cleaned at low temperatures by H-plasma, were studied by Angle Resolved UV-Photoemission Spectroscopy(ARUPS). In the case of Si(100), H-plasma exposure produced ordered H-terminated crystallographic structures with either a 2×1 or 1×1 LEED pattern while for Ge(100) a weak H-terminated 2x1 pattern was obtained. The hydride phases, found on the surfaces of the cleaned Si(100), were shown to depend on the temperature of the surface during H-plasma cleaning. The electronic stat… Show more

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Cited by 3 publications
(2 citation statements)
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“…On several samples, the native oxide layer was first removed by etching with hydrofluoric (HF) acid (50:1 deionized water/HF) before exposure to ultraviolet/ozone (UV/O 3 ) cleaning. The UV/O 3 cleaning chamber will remove hydrocarbons on the surface and produce an oxidized surface containing a high density of −OH groups at the surface. ,, The wafers were coated with copolymer immediately after removing them from the cleaning chamber to minimize contamination from the atmosphere. (2) The second method was based on the Standard Clean 1 (SC1) step of the standard RCA clean.…”
Section: Methodsmentioning
confidence: 99%
“…On several samples, the native oxide layer was first removed by etching with hydrofluoric (HF) acid (50:1 deionized water/HF) before exposure to ultraviolet/ozone (UV/O 3 ) cleaning. The UV/O 3 cleaning chamber will remove hydrocarbons on the surface and produce an oxidized surface containing a high density of −OH groups at the surface. ,, The wafers were coated with copolymer immediately after removing them from the cleaning chamber to minimize contamination from the atmosphere. (2) The second method was based on the Standard Clean 1 (SC1) step of the standard RCA clean.…”
Section: Methodsmentioning
confidence: 99%
“…3(a) inset]. The increase in 'GeO x ' thickness was attributed to the optical contribution from increased surface roughness as a consequence of surface disordering [8]. A similar effect was also observed on Si surface [9].…”
Section: A In-situ Process Optimizationmentioning
confidence: 66%