Surface formation, morphology, integrity and wire marks in diamond wire slicing of mono-crystalline silicon in the photovoltaic industry

Qiu, Jian; Li, Xiaofei; Ge, Rile; Liu, Chongning

doi:10.1016/j.wear.2021.204186

Cited by 16 publications

(6 citation statements)

References 53 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…With the increase in wire tension, the swing amplitude of the diamond wire decreases from 9.5 μm to 6.3 μm. The higher wire tension can cause the diamond wire to be tightly pressed at the bottom of the V-shaped groove, as shown in Figure 6 a, so that it is more difficult for it to roll along the bottom arc of the groove under no-load conditions, with this result being consistent with the work of Qiu et al [ 30 ]. Eventually, this leads to a reduction in the diamond wire swing amplitude.…”

Section: Resultssupporting

confidence: 86%

“…As shown in Figure 6 a, the radius of the arc at the bottom of the V-shaped groove is slightly larger than the outer diameter of the diamond wire. Qiu et al [ 30 ] found that the non-co-planar phenomena of the driver roller and wheels caused a certain torsion in the diamond wire transmission process. This promotes the diamond wire rolling along the bottom of the V-shaped groove to have a period equal to that of the reciprocating motion.…”

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Experimental Investigation on the Surface Formation Mechanism of NdFeB during Diamond Wire Sawing

Zhang

Feng

et al. 2023

Materials

View full text Add to dashboard Cite

Diamond wire sawing is widely used in processing NdFeB rare earth permanent magnets. However, it induces periodic saw marks and fracture chipping pits, which severely affect the flatness and surface quality of the products. In this study, the lateral motion of the diamond wire was monitored to determine the surface formation mechanism. Then, a white light interferometer and an SEM were used to observe the sawed surface profile. Finally, the surface quality was quantitatively studied by identifying the area rate of fracture chipping pits with an image recognition MATLAB script. According to the observation results, the calculation formula of PV which is related to the process parameters was deduced. Additionally, by combining the fracture rate and wire vibration, a novel method was proposed to investigate the optimal process parameters. It can be found that the surface quality sawed at P = 0.21 MPa, vf = 0.2 mm/min, and vs = 1.8 m/s remains better than when sawed at P = 0.15 MPa, vf = 0.1 mm/min, and vs = 1.8 m/s, which means the sawing efficiency can be doubled under such circumstances, i.e., when the surface quality remains the same.

show abstract

Section: Resultssupporting

confidence: 86%

Section: Resultsmentioning

confidence: 99%

Experimental Investigation on the Surface Formation Mechanism of NdFeB during Diamond Wire Sawing

Zhang

Feng

et al. 2023

Materials

View full text Add to dashboard Cite

show abstract

“…They then investigated the properties of the sliced wafers, including the thickness deviation and the surface roughness. Qiu et al [9] emphasized analytical models and designed experiments to describe the surface formation, the wire mark formation, and the crack generation during cutting with a diamond multi-wire saw. As sawing machines have developed, a rocking cutting structure for slicing workpieces has emerged; this structure reduces the contact length and improves the cutting efficiency of multi-wire saws [10][11].…”

Section: Introductionmentioning

confidence: 99%

Experimental study regarding the surface roughness of circular crystal wafers sliced by a multi-wire saw with reciprocating and rocking functions

lin,

Huang,

2024

Preprint

View full text Add to dashboard Cite

At present, wire sawing technology is the primary slicing method used for certain brittle materials, including monocrystalline silicon, sapphire, and silicon carbide. The surface quality of the sawn wafers significantly impacts subsequent machining processes, such as grinding and polishing. A theoretical model was developed to predict the amount of material removed per unit length of wire during the slicing of circular workpieces by a wire saw with reciprocating and rocking functions. Experiments were conducted during this study in which crystal ingots were sliced using a multi-wire saw, and the amount of material removed per unit length of wire was determined at different cutting positions on the workpiece cross-section. The surface roughness of each crystal wafer was measured systematically. The experimental results revealed that the surface roughness values measured at different points at the same y-coordinate position on a single wafer were approximately equal. However, the surface roughness was greatest on both the initial and final cutting edges and gradually decreased toward the wafer center. The surface roughness was also greatest for the wafer cut nearest to the new wire side, though it gradually decreased for wafers cut nearer to the center of the workpiece and remained relatively consistent from the middle wafer to the wafer cut nearest to the used wire side. The results also indicated that both the material removed per unit length of wire and the surface roughness of the wafer decreased with increases in the wire speed. The relationship between the material removed per unit length of wire and the surface roughness was approximately linear. When the material removed per unit length of wire was set to 0.00333 mm³/m, the average wafer surface roughness was 0.45 µm.

show abstract

“…The materials processed are mainly focused on silicon crystals. It was found that wire saw cutting parameters have a significant effect on as-sawn slice surface properties [ 16 , 17 , 18 , 19 , 20 , 21 ]. Yin et al [ 16 ] and Liu et al [ 17 ] found that high wire speeds and low workpiece feed speeds resulted in a better slice-surface quality in their experiments of cutting polysilicon using diamond saw wires with different diameters.…”

Section: Introductionmentioning

confidence: 99%

“…Yin et al [ 16 ] and Liu et al [ 17 ] found that high wire speeds and low workpiece feed speeds resulted in a better slice-surface quality in their experiments of cutting polysilicon using diamond saw wires with different diameters. Qiu et al [ 18 , 19 ] found that increasing the saw wire speed and decreasing the feed rate are beneficial for improving the sawing performance and reducing the surface roughness of photovoltaic silicon wafers in multi-wire cutting. Costa et al [ 20 ] found a similar pattern of effects when cutting polysilicon.…”

Section: Introductionmentioning

confidence: 99%

Influence of Diamond Wire Saw Processing Parameters on the Sawn Surface Characteristics of Silicon Nitride Ceramics

Zhang,

Gao,

Zhang

et al. 2023

Micromachines

View full text Add to dashboard Cite

For the slicing of superhard silicon nitride ceramics, diamond wire sawing technology has great potential for application, and its slicing surface characteristics are an important indicator of cutting quality. In this paper, the sawing experiments of silicon nitride ceramics were carried out within the range of industrial processing parameters of diamond wire sawing (saw wire speed: 800–1600 m/min, workpiece feed speed 0.1–0.4 mm/min). The effects of cutting parameters on the surface morphology, surface roughness and waviness of the as-sawn slices were analyzed. The results show that within the range of sawing parameters for industrial applications, the material on the diamond wire as-sawn surface of silicon nitride ceramics is removed mainly in a brittle mode, with the slice morphology showing brittle pits and regularly distributed wire marks in the 20–55 μm scale range. The surface roughness of the slices along the workpiece feed direction ranges from 0.27 to 0.38 μm and decreases with increasing saw wire speed and decreasing feed rate. The surface waviness ranges from 0.09 to 0.21 μm, which is in good agreement with the changing trend of the sliced-surface roughness. The results of the study provide an experimental reference for promoting the engineering application of diamond wire sawing technology to the processing of silicon nitride ceramic slices.

show abstract

Surface formation, morphology, integrity and wire marks in diamond wire slicing of mono-crystalline silicon in the photovoltaic industry

Cited by 16 publications

References 53 publications

Experimental Investigation on the Surface Formation Mechanism of NdFeB during Diamond Wire Sawing

Experimental Investigation on the Surface Formation Mechanism of NdFeB during Diamond Wire Sawing

Experimental study regarding the surface roughness of circular crystal wafers sliced by a multi-wire saw with reciprocating and rocking functions

Influence of Diamond Wire Saw Processing Parameters on the Sawn Surface Characteristics of Silicon Nitride Ceramics

Contact Info

Product

Resources

About