Surface micromachined pressure sensors with integrated CMOS read-out electronics

Dudaicevs, H.; Kandler, M.; Manoli, Yiannos; Mokwa, W.; Spiegel, Efrat

doi:10.1016/0924-4247(94)80002-2

Cited by 81 publications

(29 citation statements)

References 13 publications

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“…Finally, the sensitivity of the new method does not depend on the ultrasound frequency in contrast to the conventional method. Therefore, the improvement in the sensitivity is even better for low frequency applications [24], [25].…”

Section: Discussionmentioning

confidence: 99%

A new detection method for capacitive micromachined ultrasonic transducers

Ergun

Temelkuran

Özbay

et al. 2001

IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

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Section: Discussionmentioning

confidence: 99%

A new detection method for capacitive micromachined ultrasonic transducers

Ergun

Temelkuran

Özbay

et al. 2001

IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

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“…Im Folgenden wird das Konzept der Softwarearchitektur für das Künstliche Akkommodationssystem, das die Anforderungen an die Softwarearchitektur erfüllt und auf Basis des Risikomanagementprozesses [ISO07] sowie des Softwarelebenszyklusprozesses [DIN07] hergeleitet wurde, vorgestellt.…”

Section: Konzeption Der Softwarestrukturunclassified

Neues Konzept für die bedarfsgerechte Energieversorgung des Künstlichen Akkommodationssystems

Nagel

2013

At - Automatisierungstechnik

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“…The pressure sensor has already been described in Figure 5. Section through a pressure sensor membrane (Trieu, 2011). more detail in Dudaicevs et al (1994), Müntjes et al (2010), Trieu (2011) and Gembaczka et al (2013).…”

Section: Capacitive Pressure Sensor Chipmentioning

confidence: 99%

Encapsulation of implantable integrated MEMS pressure sensors using polyimide epoxy composite and atomic layer deposition

Gembaczka¹,

Görtz²,

Celik³

et al. 2014

J. Sens. Sens. Syst.

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Abstract. Implantable MEMS sensors are an enabling technology for diagnostic analysis and therapy in medicine. The encapsulation of such miniaturized implants remains a largely unsolved problem. Medically approved encapsulation materials include titanium or ceramics; however, these result in bulky and thick-walled encapsulations which are not suitable for MEMS sensors. In particular, for MEMS pressure sensors the chip surface comprising the pressure membranes must be free of rigid encapsulation material and in direct contact with tissue or body fluids. This work describes a new kind of encapsulation approach for a capacitive pressure sensor module consisting of two integrated circuits. The micromechanical membrane of the pressure sensor may be covered only by very thin layers, to ensure high pressure sensitivity. A suitable passivation method for the high topography of the pressure sensor is atomic layer deposition (ALD) of aluminium oxide (Al 2 O 3 ) and tantalum pentoxide (Ta 2 O 5 ). It provides a hermetic passivation with a high conformity. Prior to ALD coating, a high-temperature resistant polyimide-epoxy composite was evaluated as a die attach material and sealing compound for bond wires and the chip surface. This can sustain the ALD deposition temperature of 275 • C for several hours without any measurable decomposition. Tests indicated that the ALD can be deposited on top of the polyimide-epoxy composite covering the entire sensor module. The encapsulated pressure sensor module was calibrated and tested in an environmental chamber at accelerated aging conditions. An accelerated life test at 60 • C indicated a maximum drift of 5 % full scale after 1482 h. From accelerated life time testing at 120 • C a maximum stable life time of 3.3 years could be extrapolated.

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Surface micromachined pressure sensors with integrated CMOS read-out electronics

Cited by 81 publications

References 13 publications

A new detection method for capacitive micromachined ultrasonic transducers

A new detection method for capacitive micromachined ultrasonic transducers

Neues Konzept für die bedarfsgerechte Energieversorgung des Künstlichen Akkommodationssystems

Encapsulation of implantable integrated MEMS pressure sensors using polyimide epoxy composite and atomic layer deposition

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