Surface modification of polyimide film by coupling reaction for copper metallization

Study of Surface Metallization of Polyimide Film and Interfacial Characterization

“…Recently, wearable and portable technologies have attracted considerable attention because multiple functions such as communication, internet, sensor, navigation, and media, can be integrated in a small and light-weight device [1][2][3][4][5][6][7][8][9]. The rapid development of wearable and portable devices has driven the microelectronic industries to develop new technologies to meet the demands of scale miniaturization and multi-functionality.…”

“…The flexible printed circuit board (FPCB) plays an important role in the development of wearable and portable devices due to its high flexibility in reducing packaging volume. Polyimide (PI) is a superior material as a substrate of FPCB and has many advantages such as light-weight, high thermal stability, and good anti-corrosion properties [1,3,6,[8][9][10][11][12][13][14][15][16][17][18][19]. PI also has a high potential in automotive applications [1] as it has a higher glass transition temperature (T g ) at 280-290 • C, which is more sustainable in a high-temperature operational environment.…”

“…A common and mature metallization method is copper clad laminate (CCL), which is performed by laminating an electro-deposited (or rolled annealed) Cu foil on a PI film with an intermediate adhesive layer [1,9]. The laminated Cu foil is usually 18-35 µm thick to sustain sufficient mechanical strength; however, this thickness issue may make CCL technology unsuitable for fine-pitched wearable and portable devices.…”

Preparation and properties of heat-sealable polyimide films with comparable coefficient of thermal expansion and good adhesion to copper matrix

“…The strong interand intra-molecular interactions in the molecular chains for standard PI films make it nearly impossible to be processed by hot-adhesion bonding procedures. In practical applications, such as in fabrication of flexible copper clad laminates (FCCLs) for advanced microelectronic assembly [6][7][8][9][10], PI film substrates have to be adhered to metals or other matrixes by the aid of additional epoxy, acrylic, silicone, or fluoro-polymer adhesives [11][12][13]. This would inevitably cause undesirable thickness increase for the components or severe reliability issues in extreme conditions.…”

On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substrates

“…For the full text of this licence, please go to: http://creativecommons.org/licenses/by-nc-nd/2.5/ INTRODUCTION HE metallization of polyimide substrates has been the subject of intense studies over the last few years as evidenced by the large range of different processes proposed and the number of research groups working in this field worldwide [1][2][3][4][5][6][7][8][9]. With the increasing industrial relevance of plastic electronics, the race is on for the development of a fast, low cost and reproducible manufacturing process that could replace the current processing techniques such as those used in the printed circuit board industry [10].…”