Surface modification of Si-containing polymers during etching for bilayer lithography

Eon, David; Poucques, Ludovic de; Peignon, M. C.; Cardinaud, Christophe; Turban, G.; Tserepi, Angeliki; Cordoyiannis, George; Valamontes, E.; Raptis, Ioannis; Gogolides, Εvangelos

doi:10.1016/s0167-9317(02)00482-3

Cited by 27 publications

(30 citation statements)

References 6 publications

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“…7 Recent studies on PDMS exposed to oxygen plasma by various surface characterizations have been reported. 9,10 However, the correlation between chemical properties and electrical properties still needs to be identified.…”

Section: Introductionmentioning

confidence: 99%

Surface analysis of plasma‐treated polydimethylsiloxane by x‐ray photoelectron spectroscopy and surface voltage decay

Youn

Huh

2003

Surface & Interface Analysis

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Section: Introductionmentioning

confidence: 99%

Surface analysis of plasma‐treated polydimethylsiloxane by x‐ray photoelectron spectroscopy and surface voltage decay

Youn

Huh

2003

Surface & Interface Analysis

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“…It has been shown in previous work [6,8] that exposure of Sicontaining polymers to O 2 -based plasmas leads to rapid oxidation of the polymer surface, transforming it to a silica-like thin (¼5 nm) layer. Therefore, this layer shows an appreciable resistance to etching in pure O 2 plasmas, in contrast to the organic underlayer (AZ5214).…”

Section: Production Of Smooth Surfacesmentioning

confidence: 99%

“…The observed formation of high roughness on Si-containing polymers treated in the RIE reactor is related to the relief of the compressive stress, developed between the bulk of the polymer lm and the silica-like thin layer (grown on the polymer surface during oxygen plasma treatment [8]), as the sample cools to room temperature following the plasma treatment. The developed stress is proportional to the temperature fall after treatment and the difference in the thermal expansion coef cients of the plasma-grown silica-like layer and the bulk polymer [9].…”

Section: Surfaces With Controlled High Roughnessmentioning

confidence: 99%

Surface roughness induced by plasma etching of Si-containing polymers

Tserepi¹,

Gogolides²,

Constantoudis³

et al. 2003

Journal of Adhesion Science and Technology

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Abstract-Interfacial properties of polymers and their control become important at submicrometer scales, as polymers nd widespread applications in industries ranging from micro-and nanoelectronics to optoelectronics and others elds. In this work, we address the issue of controlled modi cation of surface topography of Si-containing polymers when subjected to oxygen-based plasma treatments. Treated surfaces were examined by atomic force microscopy to obtain surface topography and roughness of plasma-treated surfaces. Our experimental results indicate that an appropriate optimization of plasma chemistry and processing conditions allows, on one hand, small values of surface roughness, a result crucial for the potential use of these polymers for sub-100 nm lithography, and, on the other hand, desirable topography, applicable for example in sensor devices. Plasma processing conditions can be modi ed to result either in smooth surfaces (rms roughness < 1 nm) or in periodic structures of controlled roughness size and periodicity.

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“…Surface modification typically includes oxidation of the PDMS surface to introduce functional hydroxyl groups that temporarily render the surface hydrophilic [18]. Previous studies have used X-ray photoelectron spectrometry (XPS) [19], scanning electron microscopy (SEM) [20] or transmission electron microscopy (TEM) [21], atomic force microscopy (AFM) [22], and film buckling [23][24][25][26] to show that the oxidation of bulk PDMS forms a thin silicate layer on the surface. However, micropost stiffness characterization [10,11,13-16,27,27] is typically conducted only before oxidation and neglects oxidation effects.…”

Section: Introductionmentioning

confidence: 99%

Oxidation stiffening of PDMS microposts

Sim

Taylor

Larsen

et al. 2015

Extreme Mechanics Letters

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This paper presents guidance for analyzing the stiffness changes of micropost arrays after oxidation. Numerous mechanobiology studies exploit micropost arrays to quantify cell-generated micropost displacements and traction forces. Cell adhesion requires surface functionalization typically facilitated by an oxidation step, which can form a glassy skin. We estimate the material properties of this skin, analytically calculate the stiffness of oxidized microposts and compare it with direct measurements. We find correction factors increase exponentially with decreasing micropost diameter. Ignoring this oxidation stiffening of microposts results in more than 200% underestimation in micropost stiffness as well as the cellular traction forces extracted from micropost deflections.

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Surface modification of Si-containing polymers during etching for bilayer lithography

Cited by 27 publications

References 6 publications

Surface analysis of plasma‐treated polydimethylsiloxane by x‐ray photoelectron spectroscopy and surface voltage decay

Surface analysis of plasma‐treated polydimethylsiloxane by x‐ray photoelectron spectroscopy and surface voltage decay

Surface roughness induced by plasma etching of Si-containing polymers

Oxidation stiffening of PDMS microposts

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