2001
DOI: 10.1016/s0022-3093(00)00430-0
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Surface morphology and electronic state characterization of Ni–P amorphous alloy films

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Cited by 29 publications
(16 citation statements)
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“…The most commonly studied region is the P 2p one and extensive data are found in the literature [17,20,23]. However, in this system, P 2p is not an adequate region to properly study the amount and the nature of phosphorus at the surface because the P 2p overlaps with a very broad shake-up (most probably, a plasmon) of the Ni 3s peak.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The most commonly studied region is the P 2p one and extensive data are found in the literature [17,20,23]. However, in this system, P 2p is not an adequate region to properly study the amount and the nature of phosphorus at the surface because the P 2p overlaps with a very broad shake-up (most probably, a plasmon) of the Ni 3s peak.…”
Section: Resultsmentioning
confidence: 99%
“…The formation of phosphorus bound to nickel is the most plausible hypothesis to be considered. Literature data on the characterization of Ni-P alloys by XPS reveal the formation of a reduced form of phosphorus which is bound to nickel [17,20,[24][25][26][27], however such analysis concerns exclusively the P 2p region. According to literature data, the binding energy of alloyed phosphorus lies within 129.0-129.7 eV in the P 2p region, depending on the phosphorus content and sample preparation method.…”
Section: Resultsmentioning
confidence: 99%
“…5, covering the whole surface. The two distincts patterns, observed on the PtePb specimen and on the other materials (represented here by PteMn), can be attributed to a novel packing arrangement that the metal atoms adopt when pure metals fuse into intermetallic phases, resulting in grains with lower free energy [32,33]. In other words, the criterion that decides which intermetallic phase will nucleate as the melt solidifies is the change in free energy, which defines the relative thermodynamic stability of each phase.…”
Section: Stmmentioning
confidence: 91%
“…Thus, the mechanism for the growth of the outer-oxide layer should involve metal diffusion of Ni outwards from NiO/Ni-P to the O 2 /NiO interface [12]. The second alternative concerns the possible formation of P 2 O 5 [16]. This product sublimes at temperatures above 360°C, explaining the possible reduction of the P content in the surface [17].…”
Section: Oxidized-copper Coatingsmentioning
confidence: 99%