2009
DOI: 10.1016/j.jallcom.2009.06.173
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Surface morphology and structure of electroless ternary NiWP deposits with various W and P contents

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Cited by 47 publications
(31 citation statements)
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“…As the tungsten concentration in the plating bath increases from bath 1 to 5 the Ni (200) peak becomes less intense and the Ni (111) increases, indicating that the incorporation of tungsten into the Ni-P matrix modify its crystallization behavior. A similar finding was reported by Balaraju et al 22 for Ni-W-P deposits obtained by electroless deposition. When the phosphorus contents decrease and tungsten increases the crystalline character of the film is enhanced and the intensity of the Ni (111) reflection becomes stronger.…”
Section: Film Structuresupporting
confidence: 90%
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“…As the tungsten concentration in the plating bath increases from bath 1 to 5 the Ni (200) peak becomes less intense and the Ni (111) increases, indicating that the incorporation of tungsten into the Ni-P matrix modify its crystallization behavior. A similar finding was reported by Balaraju et al 22 for Ni-W-P deposits obtained by electroless deposition. When the phosphorus contents decrease and tungsten increases the crystalline character of the film is enhanced and the intensity of the Ni (111) reflection becomes stronger.…”
Section: Film Structuresupporting
confidence: 90%
“…It is seen that the Ni/P increases from baths 1 to 5 due to the reduced phosphorus concentration. The gradual increase of tungsten concentration makes the Ni/W and P/W ratios decrease from baths 2 to 5, confirming the results reported by Balaraju et al 22 . Film thickness was assessed by analyzing SEM micrographs of the cross-sections of the deposited films.…”
Section: Film Composition and Morphologysupporting
confidence: 90%
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