Surface-mountable capacitive tactile sensors with flipped CMOS-diaphragm on a flexible and stretchable bus line

Asano, Sho; Muroyama, Masanori; Bartley, Travis; Kojima, Takahiro; Nakayama, Takahiro; Yamaguchi, Ui; Yamada, Hitoshi; Nonomura, Yutaka; Hata, Yoshiyuki; Funabashi, Hirofumi; Tanaka, Shuji

doi:10.1016/j.sna.2016.01.043

Cited by 21 publications

(11 citation statements)

References 20 publications

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“…Figure 2 shows the first type of tactile sensor. (3,4) The LSI wafer and a special low temperature cofired ceramic (LTCC) via wafer (5) are bonded and interconnected by Au-Au bonding. (6) The diaphragm is fabricated in the LSI wafer by deep reactive ion etching (DRIE) after bonding.…”

Section: Technical Overviewmentioning

confidence: 99%

Faster and More Cost-Effective Way to Success in MEMS R&D by Open Collaboration in Tohoku University

2018

Sensors and Materials

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In this paper, "Open Collaboration" is defined as research and development (R&D) in a value/supply chain composed of different organizations including companies, universities and research institutes. If Open Collaboration is defined like this, it is not new, but it was not working well in Japanese universities. This paper first explains the scheme of Open Collaboration of micro-electromechanical systems (MEMS) in Tohoku University. Then, the project of integrated tactile sensors is described as a successful example of Open Collaboration. The purpose of this paper is to promote Open Collaboration in the field of MEMS by introducing our practices.

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Section: Technical Overviewmentioning

confidence: 99%

Faster and More Cost-Effective Way to Success in MEMS R&D by Open Collaboration in Tohoku University

2018

Sensors and Materials

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“…The capacitive sensor structure is sealed with an Au sealing frame. Although we have formed a diaphragm with tapered boss by anisotropic wet etching in the previous study [ 15 ], the side surface of the diaphragm and the boss is vertical in this study to enhance sensitivity to normal force and shear force. The capacitive gap of 4.5 µm, which is smaller than that of the previous sensor (10 µm), also enables the enhancement of sensitivity and the prevention of large diaphragm deflection.…”

Section: Designmentioning

confidence: 99%

“…The dimension of the diaphragm was determined to be 1.3 mm square, in which no analog circuits is located, to avoid piezoelectric effect to the analog circuits. The thickness of the diaphragm was determined to be 50 µm, as with the previous study [ 15 ]. The dimension of the boss is 0.4 mm square.…”

Section: Designmentioning

confidence: 99%

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3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer

Asano

Muroyama

Nakayama

et al. 2017

Sensors

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This paper reports a 3-axis fully integrated differential capacitive tactile sensor surface-mountable on a bus line. The sensor integrates a flip-bonded complementary metal-oxide semiconductor (CMOS) with capacitive sensing circuits on a low temperature cofired ceramic (LTCC) interposer with Au through vias by Au-Au thermo-compression bonding. The CMOS circuit and bonding pads on the sensor backside were electrically connected through Au bumps and the LTCC interposer, and the differential capacitive gap was formed by an Au sealing frame. A diaphragm for sensing 3-axis force was formed in the CMOS substrate. The dimensions of the completed sensor are 2.5 mm in width, 2.5 mm in length, and 0.66 mm in thickness. The fabricated sensor output coded 3-axis capacitive sensing data according to applied 3-axis force by three-dimensional (3D)-printed pins. The measured sensitivity was as high as over 34 Count/mN for normal force and 14 to 15 Count/mN for shear force with small noise, which corresponds to less than 1 mN. The hysteresis and the average cross-sensitivity were also found to be less than 2% full scale and 11%, respectively.

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“…These advantages include higher sensitivity, rapid detection, and the integration of electrical readout circuits and sensing electrodes on a single chip. In spite of microelectromechanical systems (MEMS)-based capacitive sensors such as accelerometers [ 1 , 2 ], position sensors [ 3 , 4 ], pressure sensors [ 5 , 6 , 7 , 8 ], and moisture sensors [ 9 ], a growing body of literature has studied capacitive sensors for Laboratory on a Chip (LoC) applications. These applications include DNA hybridization detection [ 10 ], protein interactions quantification [ 11 ], cellular monitoring [ 12 , 13 , 14 ], bio-particle detection [ 15 ], microRNA detection [ 16 ], organic solvent monitoring [ 17 ], sensing of droplet parameters [ 18 ], and bacteria detection [ 19 , 20 ].…”

Section: Introductionmentioning

confidence: 99%

Toward High Throughput Core-CBCM CMOS Capacitive Sensors for Life Science Applications: A Novel Current-Mode for High Dynamic Range Circuitry

Forouhi

Dehghani

Ghafar-Zadeh

2018

Sensors

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This paper proposes a novel charge-based Complementary Metal Oxide Semiconductor (CMOS) capacitive sensor for life science applications. Charge-based capacitance measurement (CBCM) has significantly attracted the attention of researchers for the design and implementation of high-precision CMOS capacitive biosensors. A conventional core-CBCM capacitive sensor consists of a capacitance-to-voltage converter (CVC), followed by a voltage-to-digital converter. In spite of their high accuracy and low complexity, their input dynamic range (IDR) limits the advantages of core-CBCM capacitive sensors for most biological applications, including cellular monitoring. In this paper, after a brief review of core-CBCM capacitive sensors, we address this challenge by proposing a new current-mode core-CBCM design. In this design, we combine CBCM and current-controlled oscillator (CCO) structures to improve the IDR of the capacitive readout circuit. Using a 0.18 μm CMOS process, we demonstrate and discuss the Cadence simulation results to demonstrate the high performance of the proposed circuitry. Based on these results, the proposed circuit offers an IDR ranging from 873 aF to 70 fF with a resolution of about 10 aF. This CMOS capacitive sensor with such a wide IDR can be employed for monitoring cellular and molecular activities that are suitable for biological research and clinical purposes.

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Surface-mountable capacitive tactile sensors with flipped CMOS-diaphragm on a flexible and stretchable bus line

Cited by 21 publications

References 20 publications

Faster and More Cost-Effective Way to Success in MEMS R&D by Open Collaboration in Tohoku University

Faster and More Cost-Effective Way to Success in MEMS R&D by Open Collaboration in Tohoku University

3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer

Toward High Throughput Core-CBCM CMOS Capacitive Sensors for Life Science Applications: A Novel Current-Mode for High Dynamic Range Circuitry

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