“…On the other hand, top-down approaches, which rely on lithographic methods and etching processes, are well-suited for integrating with three-dimensional (3D) systems, hierarchical assemblies, and large-scale implementation. Si NWs created by both metal-assisted chemical etching (MACE) 33 and super- 31 CrSi 2 , 38 Si, 33 PbSe, 27 Bi 2 Te 3 , 44,45 InSb, 46 IGZO, 53 PbTe, 47 Si 0.73 Ge 0.27 , 43 Bi 0.5 Sb 1.5 Te 3 , 32 InSb, 48 CsSnI 3 , 49 SnTe, 50 Bi/Te, 51 and SnSe. 52 The investigated nanowire arrays and composite materials include Si NW arrays, 35,36,39 Te/Bi core/shell composites, 54 Te NW-PEDOS:PSS hybrid, 55 Bi 2 Te 3 composites, 28 β-Zn 4 SB 3 , 56 Te-Bi 2 Te 3 , 57 AgTe 2 -Bi 2 Te 3 , 58 PbTe, 29 La 0.9 Sr 0.1 CoO 3 , 59 Bi 2 (Te,Se) 3 , 60 PbTe-Ag 2 Te, 30 Bi 2 Te 3 -graphene, 61 Bi 2 Te 2.7 Se 0.3 alloys, 62 Sb 2 Se 3 NW bundles, 63 Bi 2 Te 2.5 Se 0.5 , 64 PbTe 0.66 Se 0.33 , 65 and (Sb,Bi) 2 Te 3 .…”