In order to achieve effective coupling between the surface plasmon and the quantum wells (QWs) for surface plasmon LEDs, metal-embedded or thin p-GaN layer approach have been normally been used, but by taking either of these methods, the enhancement of the IQE of the fabricated SPLEDs is not remarkable, in some cases, the internal quantum efficiency even decreases. Here, this study is to clarify the origin and understand what kind of influence of temperature treatment to the LED structure. GaN based LEDs with Ag from the same epitaxial wafer were annealed under different temperatures to imitate the high temperature treatment during the SP-LED fabrication. The results show that the diffusion of Ag into the quantum wells could be one of the reasons and in order to realize SP-LEDs with high IQE, high temperature treatments need to be avoided to prevent the diffusion of metal.
I. IntroductionGaN-based light-emitting diodes (LEDs) have become as a promising candidate for next generation high-brightness solidstate lighting because of many advantages, such as energy saving and environment friendly [1], and with different indium composition, it can cover the UV to longer-wavelength spectral region. However, as the emission wavelength approaches to the green light region, the internal quantum efficiency (IQE) suffers an obvious loss due to poor crystal quality [2], serious quantum confined stark effect (QCSE) [3] and efficiency droop [4]. Various methods have been proposed to address the above issues [5][6][7].Recently, surface plasmon (SP) coupling have drawn a lot of attention, since it can effectively enhance the IQE by offer an extra emission channel [8][9][10]. To achieve high performance SP-LEDs, one of the most important key points is to get close-distance coupling between surface plasmon and the QWs. In order to realize the close-distance coupling, it has been reported to use metal-embedded or thin p-GaN layer approach [11][12][13][14][15]. However, by taking either of two methods above, the enhancement of the IQE of the fabricated SP-LEDs is not remarkable. In some cases, the IQE even decreases. The reason could be related to the material degeneration, which is caused by the metal diffusion during the regrowth or the thermal treatment in the thin p-GaN layer method. Here, the aim of this study is to clarify the origin and understand what kind of influence of temperature treatment to the LED structure.Similar LED samples from the same wafer were annealed under different temperature to imitate the high temperature treatments during the SP-LED fabrication. Photoluminescence (PL) measurements were before and after the temperature treatments using 325nm He-Cd laser irradiation. Secondary ion mass spectrometry (SIMS) depth profile was performed to acquire the diffusion degree of the metal. In Sec. II of this paper, fabrication procedure and characterization results of the LED samples are presented, and discussions are provided. In Sec. III conclusions and summary are drawn. Figure 1 illustrates the procedure flow chart...