2004
DOI: 10.1016/j.mee.2004.01.012
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Surface preparation and post thermal treatment effects on interface properties of thin Al2O3 films deposited by ALD

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Cited by 28 publications
(24 citation statements)
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“…However, Al 2 O 3 in MOS devices is usually deposited via atomic layer deposition, which results in an amorphous phase with electronic properties differing considerably from those of crystalline phases. [21][22][23][24] Furthermore, the experimental characterization of defect states in a-Al 2 O 3 has led to conflicting interpretations. The oxygen vacancy has been invoked as an electron trap in oxygen-deficient a-Al 2 O 3 films on the basis of electron energy loss, photoluminescence, and capacitance measurements, and this suggestion has received support from theoretical studies based on density-functional-theory calculations.…”
mentioning
confidence: 99%
“…However, Al 2 O 3 in MOS devices is usually deposited via atomic layer deposition, which results in an amorphous phase with electronic properties differing considerably from those of crystalline phases. [21][22][23][24] Furthermore, the experimental characterization of defect states in a-Al 2 O 3 has led to conflicting interpretations. The oxygen vacancy has been invoked as an electron trap in oxygen-deficient a-Al 2 O 3 films on the basis of electron energy loss, photoluminescence, and capacitance measurements, and this suggestion has received support from theoretical studies based on density-functional-theory calculations.…”
mentioning
confidence: 99%
“…After forming gas 400 1C annealing for 5 min, the electrical characteristics showed little improvements. It has been reported by several groups that for ALD direct growth of high-k materials on H-terminated silicon, retardation in nucleation on the clean Si surface in the first few cycles led to poor interface and rough film surfaces [3][4][5][6]. The island growth results in electrically leaky films.…”
Section: Methodsmentioning
confidence: 99%
“…Therefore, influences of radiation on the electrical characteristics of MOS devices are complicated in nature [5]. Various dielectric materials such as Al 2 O 3 [6], HfO 2 [7,8], TiO 2 [9,10], La 2 O 3 [11] and ZrO 2 [12] have been studied for MOS-based technology to substitute conventional SiO 2 layer. However, there is not enough knowledge in the literature about their radiation responses.…”
Section: Introductionmentioning
confidence: 99%