A radical-enhanced atomic layer deposition (RE-ALD) process was developed for growing ferrimagnetic CoFeO thin films. By utilizing bis(2,2,6,6-tetramethyl-3,5-heptanedionato) cobalt(II), tris(2,2,6,6-tetramethyl-3,5-heptanedionato) iron(III), and atomic oxygen as the metal and oxidation sources, respectively, amorphous and stoichiometric CoFeO films were deposited onto SrTiO (001) substrates at 200 °C. The RE-ALD growth rate obtained for CoFeO is ∼2.4 Å/supercycle, significantly higher than the values reported for thermally activated ALD processes. Microstructural characterization by X-ray diffraction and transmission electron microscopy indicate that the CoFeO films annealed between 450 and 750 °C were textured polycrystalline with an epitaxial interfacial layer, which allows strain-mediated tuning of the magnetic properties given its highly magnetostrictive nature. The magnetic behavior was studied as a function of film thickness and annealing temperature: saturation magnetization (M) ranged from 260 to 550 emu/cm and magnetic coercivity (H) ranged from 0.2 to 2.2 kOe. Enhanced magnetic anisotropy was achieved in the thinner samples, whereas the overall magnetic strength improved after annealing at higher temperatures. The RE-ALD CoFeO thin films exhibit magnetic properties that are comparable to both bulk crystal and films grown by other deposition methods, with thickness as low as ∼7 nm, demonstrating the potential of RE-ALD for the synthesis of high-quality magnetic oxides with large-scale processing compatibility.