A SF 6 /Ar inductively coupled plasma (ICP) technique was investigated to improve etching of proton exchanged LiNbO 3 . The influences of He backside cooling, power, and gas flows on characteristics such as etching rate, sidewall slope angle, and surface roughness were investigated. Total gas flow is a key parameter that affects etching results, and an optimized gas flow (50 sccm) was used for lengthy etching processes (30 min). Deep (>3 lm) and highly anisotropic etching, as well as ultra smooth LiNbO 3 surfaces were achieved in a single-step run. The authors' proposed method has achieved the deepest, most vertical, minimal residue structure yet reported for single-step ICP etching.