Surface self diffusion measurements on nickel by the mass transfer method

Blakely, J. M.; Mykura, H.

doi:10.1016/0001-6160(61)90034-7

Cited by 100 publications

(28 citation statements)

References 12 publications

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“…This disagreement may be associated with the nonequilibrium grain boundary structure; there are reports of "anomalous" diffusion in nanocrystalline materials due to presumed nonequilibrated grain boundaries exhibiting diffusion properties more like a free surface. [43][44][45] The activation energy for surface selfdiffusion on a (111) plane in Ni is 60 kJ/mol, 46 which is reasonably close to what we measure in Fig. 3.…”

Section: A Linear Hardening Regimesupporting

confidence: 85%

Grain boundary relaxation strengthening of nanocrystalline Ni–W alloys

2012

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The hardening effect caused by the relaxation of nonequilibrium grain boundary structure has been explored in nanocrystalline Ni-W alloys. First, the kinetics of relaxation hardening are studied, showing that higher annealing temperatures result in faster, more pronounced strengthening. Based on the temperature dependence of relaxation strengthening kinetics, triple junction diffusion is suggested as a plausible kinetic rate limiter for the removal of excess grain boundary defects in these materials. Second, the magnitude of relaxation strengthening is explored over a wide range of grain sizes spanning the Hall-Petch breakdown, with an apparent maximum hardening effect found at a grain size below 10 nm. The apparent activation volume for plastic deformation is unaffected by annealing for grain sizes down to ;10 nm, but increases with annealing for the finest grain sizes, suggesting a change in the dominant deformation mechanism for these structures.

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Section: A Linear Hardening Regimesupporting

confidence: 85%

Grain boundary relaxation strengthening of nanocrystalline Ni–W alloys

2012

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“…7,18 For Ni at 473 K, the diffusivity of surface self-diffusion is estimated to be D s $ 10 À17 À 10 À14 m 2 /s. [26][27][28] At a timescale s $ 4 Â 10 2 s, the diffusion distance L ¼ ffiffiffiffiffiffiffi ffi D s s p $ 63 nm to 2 lm, larger than the grain size in the as-deposited nickel films ($20-40 nm, determined using TEM). Therefore, surface diffusion is fast enough to lead to changes in the structure associated with each grain surface as proposed in the model.…”

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confidence: 98%

Correlation of shape changes of grain surfaces and reversible stress evolution during interruptions of polycrystalline film growth

Thompson

2014

Applied Physics Letters

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Articles you may be interested inEffect of adatom surface diffusivity on microstructure and intrinsic stress evolutions during Ag film growth J. Appl. Phys. 112, 043503 (2012); 10.1063/1.4746739 Kinetic model for dependence of thin film stress on growth rate, temperature, and microstructure J. Appl. Phys. 111, 083520 (2012); 10.1063/1.4704683 Contact stress analysis of lightly compressed thin films: Modeling and experimentationInterdependence between stress, preferred orientation, and surface morphology of nanocrystalline TiN thin films deposited by dual ion beam sputtering

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“…Quantitative data were also obtained using the model and will be presented in the next chapter along with the experimental data. As shown in Table 5-1 and Table 5-2, the surface self-diffusivity data obtained from literature 36,37 contains significant ranges of error, while the ranges of error in energy are comparatively small 38, 39. Changing the energy within the given ranges of error generally did not change the retraction rate significantly.…”

Section: Discussionmentioning

confidence: 98%

Quantitative analysis of anisotropic edge retraction by solid-state dewetting of thin single crystal films

Kim

Zucker

et al. 2013

Journal of Applied Physics

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In the as-deposited state, thin films are generally far from equilibrium and will agglomerate or dewet to form arrays of islands when sufficient atomic motion is allowed. Dewetting can occur well below the films' melting temperature in the solid-state. The dewetting process begins by formation and motion of film-substrate-vapor three-phase boundaries. These film edges retract via capillarity-driven mass transport. In the absence of film or substrate patterning, the dewetting morphology of polycrystalline films is not well ordered. However, dewetting in single crystal films leads to a much more regular morphology, due to surface and interfacial energy anisotropy and surface self-diffusivity anisotropy. When dewetting of such films is templated by pre-patterning, dewetting patterns much smaller than the original template patterns can be generated. This makes templated dewetting a potential self-assembly method for generation of complex structures with sub-lithographic length scales. However, control of such patterns in single crystal films requires a significant degree of quantitative understanding of anisotropic dewetting in the solid-state.

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Surface self diffusion measurements on nickel by the mass transfer method

Cited by 100 publications

References 12 publications

Grain boundary relaxation strengthening of nanocrystalline Ni–W alloys

Grain boundary relaxation strengthening of nanocrystalline Ni–W alloys

Correlation of shape changes of grain surfaces and reversible stress evolution during interruptions of polycrystalline film growth

Quantitative analysis of anisotropic edge retraction by solid-state dewetting of thin single crystal films

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